HP ZBook Studio G7 User Manual

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description
Notes
Quantity of
items
included in
product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
Philip #1
Screwdriver
Philip #0
Screwdriver
Philip #T5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove Log Low
2. Remove Battery pack
3. Remove FAN & Thermal module
4. Remove Motherboard
5. Remove Speaker Rear & Cavity
6. Remove Hinge for the Logic Up
7. Remove Hinge Cap
8. Remove Both Hinge
9. Remove LCD Cover
10. Remove Antenna
11. Remove EDP cable / TS / Camera module / Sensor PCB
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).

HP ZBook Studio G7 Specifications

General

ECC	No
Memory slots	1x DIMM
Internal memory	16 GB
Memory clock speed	2666 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	1 x 16 GB
Form factor	Clamshell
Product type	Mobile workstation
Product color	Silver
Country of origin	China
Intel® vPro™ Platform Eligibility	Yes
Color gamut	72 %
RGB color space	NTSC
Display diagonal	15.6 \
Anti-glare screen	Always gives an optimal view, even in direct sunlight.
Display brightness	400 cd/m²
Native aspect ratio	16:9
Display bezel technology	Micro-Edge
Display diagonal (metric)	39.6 cm
Pointing device	Touchpad
Keyboard special features	Étanche
Tjunction	100 °C
Processor cache	12 MB
Processor cores	6
System bus rate	8 GT/s
Processor family	Intel® Core™ i7
Processor socket	BGA 1440
Processor threads	12
Processor codename	Comet Lake
Processor frequency	2.7 GHz
Processor cache type	L3
Configurable TDP-down	35 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	5.1 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	45 W
Maximum number of PCI Express lanes	16
HP segment	Business
HP speaker type	HP Dual Speakers
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	NVMe
Storage media	SSD
SSD form factor	M.2
SSD memory type	TLC
Total storage capacity	512 GB
Compatible memory cards	SD
Number of SSDs installed	1
Discrete GPU manufacturer	NVIDIA
On-board graphics card ID	0x9BC4
Discrete graphics card model	NVIDIA Quadro RTX 3000
On-board graphics card model	Intel® UHD Graphics
Discrete graphics card memory	6 GB
Discrete graphics memory type	GDDR6
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Battery capacity	83 Wh
AC adapter power	150 W
Number of built-in speakers	2
MIMO type	Multi User MIMO
Antenna type	2x2
Bluetooth version	5.0
Top Wi-Fi standard	Wi-Fi 6 (802.11ax)
WLAN controller model	Intel Wi-Fi 6 AX201
Sustainability certificates	ENERGY STAR
HDMI ports quantity	-
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	0
Processor ARK ID	201897
Processor package size	42 x 28 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0

Weight and Dimensions

Depth	234.6 mm
Width	354 mm
Height	17.9 mm
Weight	1740 g