HP ZBook Studio G7 User Manual

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: External Options
Marketing Name / Model: HP ZBook Studio G7 Mobile Workstation
[List multiple models if applicable.]
Mulberry
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries Battlery
1
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[1] screws
[x] snaps
[x] adhesive
[x] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps LCD
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Power cords,Adapter
2
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs

HP ZBook Studio G7 Specifications

General

ECC	No
Memory slots	1x DIMM
Internal memory	16 GB
Memory clock speed	2666 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	1 x 16 GB
Form factor	Clamshell
Product type	Mobile workstation
Product color	Silver
Country of origin	China
Intel® vPro™ Platform Eligibility	Yes
Color gamut	72 %
RGB color space	NTSC
Display diagonal	15.6 \
Anti-glare screen	Always gives an optimal view, even in direct sunlight.
Display brightness	400 cd/m²
Native aspect ratio	16:9
Display bezel technology	Micro-Edge
Display diagonal (metric)	39.6 cm
Pointing device	Touchpad
Keyboard special features	Étanche
Tjunction	100 °C
Processor cache	12 MB
Processor cores	6
System bus rate	8 GT/s
Processor family	Intel® Core™ i7
Processor socket	BGA 1440
Processor threads	12
Processor codename	Comet Lake
Processor frequency	2.7 GHz
Processor cache type	L3
Configurable TDP-down	35 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	5.1 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	45 W
Maximum number of PCI Express lanes	16
HP segment	Business
HP speaker type	HP Dual Speakers
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	NVMe
Storage media	SSD
SSD form factor	M.2
SSD memory type	TLC
Total storage capacity	512 GB
Compatible memory cards	SD
Number of SSDs installed	1
Discrete GPU manufacturer	NVIDIA
On-board graphics card ID	0x9BC4
Discrete graphics card model	NVIDIA Quadro RTX 3000
On-board graphics card model	Intel® UHD Graphics
Discrete graphics card memory	6 GB
Discrete graphics memory type	GDDR6
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Battery capacity	83 Wh
AC adapter power	150 W
Number of built-in speakers	2
MIMO type	Multi User MIMO
Antenna type	2x2
Bluetooth version	5.0
Top Wi-Fi standard	Wi-Fi 6 (802.11ax)
WLAN controller model	Intel Wi-Fi 6 AX201
Sustainability certificates	ENERGY STAR
HDMI ports quantity	-
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	0
Processor ARK ID	201897
Processor package size	42 x 28 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0

Weight and Dimensions

Depth	234.6 mm
Width	354 mm
Height	17.9 mm
Weight	1740 g

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

Components with a surface area greater than 10 sq cm requiring selective treatment.

Batteries Requiring Selective Treatment

Includes Li-Ion batteries and other types like alkaline, coin, or button style batteries.

Mercury-Containing Components

Components containing mercury, such as in lamps and display backlights.

Liquid Crystal Displays (LCD)

LCDs with a surface area greater than 100 sq cm, including backlit displays.

Tools Required for Disassembly

Screwdrivers for Disassembly

Various screwdriver types and sizes (e.g., Philip #1, #0, #T5) needed for component removal.

Product Disassembly Process Steps

External Enclosure Removal

Basic steps to remove the external enclosure for accessing internal components.

Internal Component Removal Sequence

Steps for removing key components like battery, FAN, motherboard, speakers, and hinges.

Display and Cable Removal

Procedure for removing the LCD cover, antenna, and EDP cable/camera module.