HPE Aruba 6200F User Manual

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking
Marketing Name / Model
[List multiple models if applicable.]
JL725A Aruba 6200F 24G CL4 4SFP+ 370W SWCH Swch
JL727A Aruba 6200F 48G CL4 4SFP+ 370W Swch
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0
Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm 3
Batteries All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
1
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos

HPE Aruba 6200F Specifications

General

Model	HPE Aruba 6200F
Operating Temperature	0°C to 45°C (32°F to 113°F)
Power Supply	Internal
Layer	Layer 3
Management	Aruba Central, CLI, Web GUI, SNMP
PoE	Optional PoE+ or PoE++ support
Input Voltage	100-240 VAC
Stacking	Up to 8 units
Jumbo Frames	Up to 9, 216 bytes
Memory	4 GB
Ports	24x 1GbE
Memory and Processor	Dual Core ARM Cortex A9 @ 1016MHz
Latency	< 2.3 µs

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

PCB/PCA components requiring selective treatment.

Batteries

All types of batteries require specific handling.

Mercury-containing components

Components containing mercury, such as lamps, need careful removal.

Liquid Crystal Displays (LCD)

LCD screens over 100 sq cm may require specific disassembly.

Cathode Ray Tubes (CRT)

CRT displays require specialized handling due to hazardous materials.

Capacitors / condensers (Containing PCB/PCT)

Capacitors over 2.5 cm need selective treatment.

External electrical cables and cords

Standard cables usually do not require special treatment.

Gas Discharge Lamps

Lamps, especially illuminated displays, may contain hazardous substances.

Plastics containing Brominated Flame Retardants

Plastics with BFRs weighing > 25g need separate handling.

Components and parts containing toner and ink

Ink and toner cartridges need specific disposal procedures.

Components and waste containing asbestos

Asbestos-containing materials are hazardous and require strict handling.

Tools Required

Torque Driver and Bits

Specific torque drivers and bits (T10, T25, M4 Philip) are needed for disassembly.

Cutter and Soldering Station

Tools like cutters and soldering stations may be required for component removal.

Product Disassembly Process

Initial Component Removal

Steps 1-10 cover initial parts removal like covers, screws, and cables.

Power Supply and PCBA Disassembly

Steps 11-26 detail removing the power supply, PCBA, and related components.

Final Chassis Component Removal

Steps 27-30 cover the final removal of chassis parts and specific components.