Huawei FusionServer G5500 - Page 29

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HPE: Apollo 6500+Power Shelf
Parameter G5500-G560 Apollo 6500
Dimensions (H x W x D)
4U (175*447*790) 4U (177*448*960) + 1.5U (65*448*784)
Architecture Modular Modular, dual nodes
CPU 2S + 24DIMM Single node: 2S + 16DIMM
Maximum CPU power 145 W 145 W
GPU 8*P100/P40/P4 Single node: 8*P100/P40
Maximum GPU power 350 W 300 W
CPU:GPU topology 1:8/1:4 flexible configuration Single node: 1:8/1:4 (optional)
Hard drive
6*2.5'' NVMe SSD
2*2.5'' SAS/SATA HDD
8*3.5'' HDD
Single node: 8*2.5'' SAS/SATA SSD/HDD
RAID RAID 0/1/10/5/50/6/60 RAID 0/1/10/5/50/6/60
PCIe expansion 4*PCIe x16 Single node: 2*PCIe x16 LP + 1*PCIe x8 LP
(RAID controller card)
On-board network adapter Single node: 2 x GE
Power supply 4400 W hot swap, 2+2 External power shelf, 6*2650W hot swap, 3+3
Fan 6 hot swap, 5+1 8 hot swap
Temperature
5°C to 35°C
10
°
C to 35
°
C. The specifications lower to 25
°
C
when more than 5 GPUs (P100) are configured.
Beating Points
• The chassis uses a modular design. A power shelf is required.
• In the 1:8 and 1:4 topologies, P2P cannot be implemented between 8 cards and 4 cards.
• Only 16 DIMMs are supported, and the memory capacity is limited.
• NVMe SSD is not supported.
• When more than 5 P100 GPUs are configured, the maximum temperature supported is only
25°C, which restricts its application.
2S + 16DIMM
8*GPU