Huawei MU509 - 2 LGA Interface Differences; LGA Interfaces

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
LGA Interface Differences
Issue 08 (2016-12-12)
HUAWEI Proprietary and Confidential
Copyright © HUAWEI Technologies Co., Ltd.
19
2 LGA Interface Differences
2.1 LGA Interfaces
Huawei 30 mm × 30 mm LGA module provides 145 pads, on which pin 1 to pin 116
are defined as signal pins and pin 121 to pin 145 are defined as heat-dissipation
ground pads.
Huawei 30 mm × 30 mm LGA module provides interfaces including power supply,
antenna, Universal Serial Bus (USB), Universal Subscriber Identity Module
(USIM)/Removable User Identity Module (RUIM), Universal Asynchronous Receiver-
Transmitter (UART), audio, Pulse-code Modulation (PCM), Light-emitting Diode
(LED), General-purpose I/O (GPIO), WAKEUP_IN, WAKEUP_OUT, SLEEP_STATUS,
power on/power off, reset, Joint Test Action Group (JTAG) interfaces, ADC interface
and so on.
Figure 2-1 Application block diagram of the 30 mm × 30 mm LGA module