Huawei MU509 - Stencil Design; Reflow Profile

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
Mechanical Specifications Compatibility
Design Guide
Issue 08 (2016-12-12)
HUAWEI Proprietary and Confidential
Copyright © HUAWEI Technologies Co., Ltd.
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3.3.2 Stencil Design
It is recommended that the stencil for the 30 mm × 30 mm LGA modules be 0.12 mm
in thickness. For the stencil design, see Figure 3-4 .
Figure 3-4 Recommended stencil design (unit: mm)
MU509-b/MU509-c/MU509-g/MC509 MU609/ME909u-521
ME209u-526/ME909u-523/MU709
/ME909s/MU509-65
3.3.3 Reflow Profile
For the soldering temperature of the 30 mm × 30 mm LGA modules, see the following
figure.