Huawei MU509 - Page 52

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
Mechanical Specifications Compatibility
Design Guide
Issue 08 (2016-12-12)
HUAWEI Proprietary and Confidential
Copyright © HUAWEI Technologies Co., Ltd.
52
Figure 3-5 Reflow profile
240
300
180
217
165
120
60
0
s
°C
60s~100s
45s~80s
235°C<Tmax<245°C
Table 3-2 Reflow parameters
Temperature Zone
Time
Key Parameter
Preheat zone (40°C–
165°C)
/
Heating rate: 0.5°C/s–2°C/s
Soak zone
(165°C–217°C)
(t1–t2): 60s–100s
/
Reflow zone (> 217°C)
(t3–t4): 45s–80s
Peak reflow temperature: 235°C –
245°C
Cooling zone
Cooling rate: 2°C/s ≤ Slope ≤ 5°C/s