Huawei MU509 - Control Interface Compatibility Design; Detailed Interface Differences

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
LGA Interface Differences
Issue 08 (2016-12-12)
HUAWEI Proprietary and Confidential
Copyright © HUAWEI Technologies Co., Ltd.
20
2.2 Control Interface Compatibility Design
2.2.1 Detailed Interface Differences
Table 2-1 Differences of the control interfaces
Pin No.
Interface
Name
MU509
MC509
MU609
ME209u
-526
ME909u
MU709
ME909s
11
Control
WAKEUP_IN
[1]
CMOS 2.6 V
CMOS 1.8 V
71
WAKEUP_OUT
[2]
CMOS 2.6 V
CMOS 1.8 V
45
W_DISABLE
GPIO
CMOS
2.6 V
CMOS
2.6 V
Reserved
15
SLEEP_STATUS
[3]
Reserved
CMOS 1.8 V
70
USIM_DET
N
N
N
N
N
Y
Y
81
POWER_ON_OFF
Y
Y
Y
Y
Y
Y
Y
100
RESIN_N
Y
Y
Y
Y
Y
Y
Y

[1]: For ME909s, the pin can be used to wake up the module.

[2] and [3]: For ME909s, when the module is not in sleep mode, this pin's drive current is 4
mA. When the module is in sleep mode, this pin's output level is low and drive
current smaller than 0.1 mA. The resistance is maintained at 5–15 K, as shown in
Figure 2-2 . The output level may be changed if there is a stronger pull-up. It is
recommended that customers take Figure 2-4 and Figure 2-5 for reference to design
their circuit.
Figure 2-2 Maintaining the resistance in sleep mode
BB Chip
Module
(Modem)
R=5–15 K