iFix RT809F - Chapter 4 Detailed Operation; 4.1 93 XX, 24 XX, 25 XX Chip Operations

Chapter 4 Detailed Operation
4.1 93XX,24XX,25XX Chips’ Reading and Writing
4.1.1 The putting place of different chips
 The putting place of DIP encapsulation chip on RT809F.
 The position of SOP encapsulation on the bounce board.