Intel WiFi Link 5100 - Using 3 D Micromanipulator to Secure Bead Location; Measuring Resistance between Thermocouple and IHS

Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
Order Number: 318676-003US 21
Intel
®
5100 MCH Chipset
Figure 12. Using 3D Micromanipulator to Secure Bead Location
Figure 13. Measuring Resistance between Thermocouple and IHS