Name: Intel WiFi Link 5100
Brand: Intel
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Intel

5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008 TDG

Order Number: 318676-003US 9

Intel

5100 MCH Chipset

1.4 Thermal Simulation

Intel provides thermal simulation models of the Intel

5100 MCH Chipset and

associated user’s guides to aid system designers in simulating, analyzing, and

optimizing their thermal solutions in an integrated, system-level environment. The

models are for use with the commercially available Computational Fluid Dynamics

(CFD)-based thermal analysis tools Flomerics* FLOTHERM* (version 5.1 or higher) and

Fluent* Icepak* (version 4.3.10 or higher). Contact your Intel field sales representative

to order the thermal models and user’s guides.

2.0 Packaging Technology

Intel

5100 MCH Chipset-based platforms consist of two individual components: the

Intel

5100 MCH Chipset and the ICH9R. The Intel

5100 MCH Chipset uses a 42.5

mm, 10-layer flip chip ball grid array (FC-BGA) package (see Figure 2, Figure 3, and

Figure 4). For information on the ICH9R package, refer to the Intel

I/O Controller Hub

9 (ICH9) Family Thermal and Mechanical Design Guidelines.

Intel

I/O Controller Hub 9 (ICH9) Family Thermal and

Mechanical Design Guidelines

http://www.intel.com/ (316974)

Quad-Core and Dual-Core Intel

Xeon

Processor 5000

Sequence with Intel

5100 Memory Controller Hub Chipset for

Communications, Embedded, and Storage Applications –

Platform Design Guide

Note 1

Quad-Core Intel

Xeon

Processor 5300 Series Datasheet http://www.intel.com/ (315569)

Quad-Core Intel

Xeon

Processor 5300 Series Specification

Update

http://www.intel.com/ (315338)

Quad-Core Intel

Xeon

Processor 5300 Series Thermal/

Mechanical Design Guidelines

http://www.intel.com/ (315794)

Quad-Core Intel

Xeon

Processor 5400 Series Datasheet http://www.intel.com/ (318589)

Quad-Core Intel

Xeon

Processor 5400 Series Specification

Update

http://www.intel.com/ (318585)

Quad-Core Intel

Xeon

Processor 5400 Series Thermal/

Mechanical Design Guidelines

http://www.intel.com/ (318611)

Quad-Core Intel

Xeon

Processor L5318 in Embedded

Applications Thermal and Mechanical Design Guidelines

http://www.intel.com/ (318474)

Various system thermal design suggestions http://www.formfactors.org

Table 2. Related Documents (Sheet 2 of 2)

Document Document Number/URL

Notes:

1. Contact your Intel sales representative. Some documents may not be available at this time.

Brand	Intel
Model	WiFi Link 5100
Category	Adapter
Language	English

Intel WiFi Link 5100 Design Guide

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