Intel
®
5100 MCH Chipset
Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
22 Order Number: 318676-003US
5.1.6 Curing Process
1. Let the thermocouple attach sit in the open air for at least half an hour. Using any
curing accelerator like the Locite* 7452 Tak Pak* accelerator for this step is not
recommended. Rapid contraction of the adhesive during curing may weaken bead
attach on the IHS.
2. Reconfirm electrical connectivity with the DMM before removing the
micromanipulator. See Section 5.1.4, step 2., and Figure 13.
3. Remove the 3D arm needle by holding down the MCH unit and lifting the arm.
4. Remove the Kapton tape, and straighten the wire in the groove so that it is flat all
the way to the end of the groove (Figure 15).
5. Using a blade, shave excess adhesive above the IHS surface (Figure 16).
Note: Take usual precautions when using open blades.
6. Install new Kapton tape to hold the thermocouple wire down, and fill the rest of the
groove with adhesive (Figure 17). Make sure the wire and insulation is entirely
within the groove and below the IHS surface.
7. Curing time for the rest of the adhesive in the groove can be reduced using the
Locite* 7452 Tak Pak* accelerator.
8. Repeat step 5. to remove any access adhesive to ensure a flat IHS for proper
mechanical contact to the heatsink surface.
Figure 14. Applying Adhesive on Thermocouple Bead
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