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Manufacturer | Intel |
---|---|
Model | Xeon X5570 |
Number of Cores | 4 |
Number of Threads | 8 |
Base Clock Speed | 2.93 GHz |
Max Turbo Frequency | 3.33 GHz |
L3 Cache | 8 MB |
TDP | 95 W |
Socket | LGA 1366 |
Manufacturing Process | 45 nm |
Memory Channels | 3 |
PCI Express Version | 2.0 |
Instruction Set | x86-64 |
Virtualization Technology | Intel VT-x |
Thermal Monitoring Technologies | Yes |
Release Date | Q1 2009 |
Memory Types | DDR3 |
Features an integrated memory controller and high-speed interconnect for scalable bandwidth and performance.
Delivers additional performance automatically when needed by taking advantage of power and thermal headroom.
Allows thread-level parallelism on each processor for more efficient use of resources.
Offers increased performance and reduced power consumption compared to FB-DDR2.
Manages core states for efficient load and idle performance within thermal envelopes.
Guidance on memory technology, bandwidth, and capacity based on sample deployments.
Details on Advanced, Standard, and Basic CPU options with their features and power ratings.
Achieving maximum bandwidth using DDR3 1333 across 3 channels per CPU with 1 DIMM per channel.
Achieving balanced performance using DDR3 1066 across 3 channels per CPU with 2 DIMMs per channel.
Achieving maximum capacity using DDR3 800 across 3 channels per CPU with 3 DIMMs per channel.
Using a balanced configuration with identical DIMM types for optimal performance.
Analysis of '2-1-1' unbalanced configurations and potential performance impacts.