Intel Xeon Phi Processor x200 User Manual

Order Number: 334785-002
Intel
®
Xeon Phi™ Processor x200
Product Family
Thermal/Mechanical Specification and Design Guide (TMSDG)
June 2017
Revision 002

Intel Xeon Phi Processor x200 Specifications

General

Architecture	Knights Landing
Process Technology	14nm
Base Clock Speed	1.3 GHz - 1.5 GHz
Turbo Boost Clock Speed	1.7 GHz
Memory Support	DDR4
Max Memory	384 GB
Memory Speed	2400 MHz
Memory Channels	6
Integrated Memory Controller	Yes
Instruction Set Extensions	AVX-512
PCI Express Lanes	36
Socket	LGA 3647
TDP	215 W
L1 Cache	32 KB per core

Summary

Processor Mechanical Design

2.1 Processor Package Mechanical Specifications

Overview of processor package mechanical design and integration, serving as the primary interface.

2.2 Processor Package Description

Details the multi-chip package, including LGA3647-1 socket interface and IHS.

2.3 Package Mechanical Dimensions

Provides processor package dimensions and tolerances, including IHS and fabric extension details.

2.3.1 Package Critical-to-Function Attributes

Lists package land dimension details, base material, plating and plating thickness.

Socket Mechanical Design

3.1 LGA3647-1 Socket Overview

Describes the SMT LGA socket for the processor, its components, and features.

3.1.1 Socket Features

Lists LGA3647-1 socket attributes, including pin grid geometry and solder ball characteristics.

3.1.2 Socket Mechanical Requirements

Details socket attachment methods and testing against mechanical shock and vibration.

3.1.2.2 Socket Loading and Deflection Specifications

Provides loading and board deflection specs for the LGA3647-1 socket.

3.2 Socket Critical-to-Function Interfaces

Lists CTF attributes for main board layout and component interface to the socket.

3.3.3 Socket-Package Contact Characteristics

Details contact count, layout, base material, plating, and paddle specifications.

3.3.3.1 Contact/Pad Mating Location

Defines offset between LGA land center and solder ball center for contact alignment.

3.3.3.2 Contact Load-Deflection Curve

Describes contact design for adequate normal force and meeting performance targets.

Retention Assembly Mechanical Design

4.1 Mechanical Retention Assembly

Describes the spring-loading mechanism for processor retention to the main board and heatsink.

4.1.1 Backplate

Details the backplate's role in structural rigidity, solder joint reliability, and material.

4.1.2 Bolster Plate with Spring

Describes the integrated subassembly with guiding posts, springs, and nuts for retention.

4.1.3 Processor Package Carrier

Details the carrier as part of PHM, its function in holding the processor and attaching to heatsink.

4.1.4 Heatsink

Specifies heatsink solution volume, material, and integration into the PHM.

4.2 Mechanical Load Specifications

Defines bolster and back plates to meet socket loading and PHM support during shock/vibration.

4.3 Heatsink Mechanical Requirements

Lists heatsink mass limits, stiffness, flatness, and base thickness attributes.

Board and System Design Guidelines

5.1 Mechanical Design Considerations

Covers retention assembly design, reference thermal solution, and validation criteria.

5.2 Printed Circuit Board (PCB) Design Considerations

Covers allowable board thickness, reference board layout, and board keep-outs.

Thermal Specifications and Design Guidelines

6.1 Thermal Specification Overview

Explains MCP thermal requirements, interface to thermal solution, and system-level cooling.

6.1.1 Thermal Design Power (TDP) and TCASE Specifications

Lists TDP and TCASE values for different processor SKUs under various workloads.

6.1.2 Case Temperature Geometry and Influence Factors

Discusses monitoring die temperatures, IHS TCASE specs, and measurement locations.

Figure 6-1. Processor Package Thermocouple Locations, Top view

Illustrates thermocouple locations on the processor package IHS for TCASE measurement.

Table 6-3. Processor TCASE Influence Parameters

6.1.3 Socket Maximum Temperature

Defines socket maximum temperature, via temperature guidance, and measurement methods.

6.1.6 Reference Thermal Solution Performance Targets

6.2 Thermal Design and Management Guidelines

Covers system thermal environmental conditions, including ambient temperature and airflow.

6.2.1 System Thermal Environmental Conditions

6.2.2 Thermal Solution Performance Characterization

6.2.4 Thermal Management Guidelines

Addresses compliance with TCASE targets, fan speed control, and thermal excursion power.

Quality and Reliability Requirements

A.1 Thermal/Mechanical Solution Stress Test

Details reliability performance evaluation using use conditions and acceleration models.