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Intel Xeon Phi Processor x200 User Manual
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Figure 2-1.
Processor Pa
ckage Assembly Sketch
Figure 2-2.
Processor with Fa
bric Package A
ssembly Sketch
Order Number: 334785-002
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
13
Processor Mechanical Design
12
14
Table of Contents
Default Chapter
3
Table of Contents
3
1 Introduction
8
Objective
8
Scope
8
Processor Mechanical Assembly
8
References
9
Related Documents
9
Terminology
10
Terms and Terminology
10
2 Processor Mechanical Design
12
Processor Package Mechanical Specifications
12
Processor Package Description
12
Processor Package Assembly Sketch
13
Processor with Fabric Package Assembly Sketch
13
Package Mechanical Dimensions
14
Processor with the Integrated Heat Spreader
14
Package Critical-To-Function Attributes
15
Other Processor Package Specific Design Attributes
15
Processor with Fabric Package Features and Design Attributes
15
Processor Mass
16
Processor Material
16
Processor Markings
16
Processor Top and Bottom View
16
Processor Materials
16
Processor Mechanical Load Specification
17
Processor Insertion Specification
17
Processor Handling Guidelines
17
Processor with Fabric Top and Bottom View
17
3 Socket Mechanical Design
19
LGA3647-1 Socket Overview
19
Socket Features
20
LGA3647-1 Socket Assembly with Pnp Covers
20
LGA3647-1 Socket Attributes
20
Socket Mechanical Requirements
21
Hexagonal Array in LGA3647 Socket BGA Ball Footprint
21
Socket Critical-To-Function Interfaces
22
Socket Loading and Deflection Specifications
22
Socket Components
23
Socket Housing
23
Socket-P1 and Bolster Plate Assembly Alignment Features
24
Socket-P1, Mechanical Retention Assembly and PHM Alignment
24
Markings
25
Socket-Package Contact Characteristics
26
LGA3647-1 Socket Contact Orientation
26
Offset between LGA Land Center and Solder Ball Center
27
Offset between LGA Land Center and Solder Ball Center
28
Solder Ball Characteristics
29
Contact Force Versus Contact Deflection Range
29
Socket Size
30
Actuation and Insertion Requirements
30
Insertion/Removal/Actuation Forces
30
Package Translation
30
Wetting Angle and Wetting Height
30
Pnp Cover Ergonomics Requirements
30
Orientation in Packaging, Shipping, and Handling
31
Pick-And-Place and Dust Cover
31
Socket and Pick-And-Place Cover Durability
31
Keep-In/Keep-Out Zone
31
4 Retention Assembly Mechanical Design
32
Mechanical Retention Assembly
32
Backplate
32
Backplate and Insulator with Mounting Screws
32
Bolster Plate with Spring
33
Processor Package Carrier
34
Bolster Plate and Spring
34
Processor Package Carrier
35
Processor with Fabric Package Carrier
35
Heatsink
36
Mechanical Load Specifications
36
Bolster Plate Mechanical Load Specifications
37
Back Plate Design Criteria
37
Bolster Plate Design Criteria
37
Heatsink Mechanical Requirements
38
Heatsink Mechanical Attributes
38
5 Board and System Design Guidelines
39
Mechanical Design Considerations
39
Components Volumetric
39
Components Mass
39
LGA3647-1 Socket and Retention Component Mass
39
Package/Socket Stack-Up Height
40
Printed Circuit Board (PCB) Design Considerations
40
Allowable Board Thickness
40
Board Keep-Outs
40
Reference Board Layout
40
Suggested Silkscreen Marking for Socket Identification
40
Board Deflection
41
Fabric Cable Assembly Design Guidance
41
6 Thermal Specifications and Design Guidelines
42
Thermal Specification Overview
42
Thermal Design Power (TDP) and TCASE Specifications
42
Case Temperature Geometry and Influence Factors
44
Processor Package Thermocouple Locations, Top View
45
Measurement Locations
46
CASE Measurement Locations
46
Socket Maximum Temperature
47
Psi Curves for the Reference Thermal Solution (Mean+3 Sigma)
47
Storage Conditions Specifications
48
Reference Design Thermal Interface Material (TIM)
48
Storage Condition Ratings
48
TIM Specification
48
Reference Thermal Solution Performance Targets
49
Thermal Design and Management Guidelines
49
System Thermal Environmental Conditions
49
Reference Heatsink Boundary Conditions and Performance Targets
49
Thermal Solution Performance Design Targets and Environment
49
Thermal Solution Performance Characterization
50
Reference Heatsink Pressure Drop Curve
50
Thermal Test Vehicle (TTV) Correction Factors
51
Thermal Management Guidelines
51
A Quality and Reliability Requirements
53
Thermal/Mechanical Solution Stress Test
53
Example Thermal Stress Test: Use Condition Environment Definitions
53
Customer Environmental Reliability Testing
54
Socket Durability Test
54
Intel Reference Component Validation
54
Example Mechanical Stress Test: Use Condition Environment Definitions
54
Ecological Requirement
55
B Supplier Listing
57
Intel Enabled Supplier Information
57
Intel Xeon Phi Processor Platform Thermal/Mechanical Assembly Part Information
58
C Processor Package Mechanical Drawings
61
Processor Package Drawing List
61
Processor PMD (Sheet 1 of 2)
62
Processor PMD (Sheet 2 of 2)
63
Processor with Fabric PMD (Sheet 1 of 2)
64
Processor with Fabric PMD (Sheet 2 of 2)
65
LGA3647-1 Socket-P1 Mechanical Drawings
66
Socket Drawing List
66
Socket Mechanical Drawing (Sheet 1 of 4)
67
Socket Mechanical Drawing (Sheet 2 of 4)
68
Socket Mechanical Drawing (Sheet 3 of 4)
69
Socket Mechanical Drawing (Sheet 4 of 4)
70
Retention Assembly Mechanical Drawings
71
Bolster Plate Assembly, 1/2
71
Bolster Plate Assembly, 2/2
71
Heatsink Module Clip (Non-Fabric), 1/2
71
Heatsink Module Clip (Non-Fabric), 2/2
71
Heatsink Module Clip (Fabric), 1/2
71
Heatsink Module Clip (Fabric), 2/2
71
Backplate
71
Bolster Plate, 1/2
71
Bolster Plate, 2/2
71
Heatsink, PCM45F TIM (Reference Only)
72
Heatsink, Nut, M4, 1/2 (Reference Only)
72
Heatsink, Nut, M4, 2/2 (Reference Only)
72
Heatsink, Nut Collar (Reference Only)
72
Heatsink, Delrin* Washer (Reference Only)
72
Bolster Plate Assembly and Dust Cover
76
Backplate Insulator
84
Back Plate, M3 Stud
85
Bolster Plate, Insulator
88
Bolster Plate, Small Guide Post
89
Bolster Plate, Large Guide Post
90
Bolster Plate, LEC Guide Pin
91
Bolster Plate, Corner Standoff
92
Bolster Plate, Spring Assembly
93
Bolster Plate, Spring
94
Bolster Plate, Spring Stud, M4
95
Bolster Plate, Spring Rivet
96
Bolster Plate, M3 Captive Nut
97
Bolster Plate, M3 Captive Nut Collar
98
F Mechanical Kozs
111
Main Board Mechanical Kozs
111
Mechanical Keep-Out Zone Drawing List
111
Processor Heatsink Module Topside Keep-Out Zone
112
Processor Heatsink Module Mounting Holes Keep-Out Zone
113
Processor Heatsink Module Backplate Keep-Out Zone
114
4
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Intel Xeon Phi Processor x200 Specifications
General
Brand
Intel
Model
Xeon Phi Processor x200
Category
Computer Hardware
Language
English
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