Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
39
Board and System Design Guidelines
5 Board and System Design
Guidelines
5.1 Mechanical Design Considerations
The processor mechanical retention assembly design and reference thermal solution
provided are appropriate for a Intel Xeon Phi Processor x200 Product Family-based
platform reference board integrated into a half-width 1U air-cooled server rack
enclosure. Any use of these components in a platform or configuration different from
the Intel reference platform requires a complete thermal and mechanical design and
validation in accordance with the customer design criteria. Also, if customer thermal
and mechanical validation criteria differ from the Intel criteria, the reference solution
should be validated against the customers design criteria. In all cases, customers must
validate their thermal and mechanical solution in accordance with their design and
environmental validation criteria, and should not rely solely on these design guidelines.
5.1.1 Components Volumetric
The baseboard Keep-Out Zones (KOZs) on the primary and secondary sides and height
restrictions under the enabling component region are shown in detail in Appendix F.
The overall volumetric keep-in zone encapsulates the processor, socket, and the entire
thermal/mechanical enabling assembly.
5.1.2 Components Mass
The Static Compressive Load should also be considered in dynamic assessments.
Direct contact between back plate and chassis pan will usually help minimize board
deflection during shock.
Table 5-1. LGA3647-1 Socket and Retention Component Mass
Component Mass
1
LGA3647-1 Socket Body, Contacts and PnP Cover 42 g (21 g per half)
Backplate Assembly 134.8 g
Bolster Plate Assembly 62.1 g
Processor Package Processor: 88.8 g
Processor with Fabric: 91.4 g
Carrier Processor: 6.8 g
Processor with Fabric: 6.2 g
Heatsink < 600 g
2
Notes:
1. May vary from supplier to supplier.
2. The reference heatsink mass is 424 g.
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