Intel Xeon Phi Processor x200 User Manual


Retention Assembly Mechanical Design
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
34
.
Figure 4-2. Bolster Plate and Spring
Bolster Plate
Assembly
Heatsink
Small Coarse
Alignment Post
Heatsink
Large Coarse
Alignment Post
Leaf Spring
Assembly
Bolster Plate
Assembly
Bolster Plate
Spring
Assembly
Pin A1 Mark
4.1.3 Processor Package Carrier
The carrier is an integral part of the Processor Heatsink Module (PHM). The processor
package is inserted into the carrier, then the Thermal Interface Material (TIM) and
heatsink are attached. The carrier design will grab onto the package, and keying
features will match cutouts on package. Hook-like features on the four corners of the
carrier will grab onto the heatsink. The carrier design changes depending on whether
the processor package does or does not integrate fabric.

Intel Xeon Phi Processor x200 Specifications

General

Brand	Intel
Model	Xeon Phi Processor x200
Category	Computer Hardware
Language	English