Intel Xeon Phi Processor x200 User Manual

Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
15

Processor Mechanical Design
2.3.1 Package Critical-to-Function Attributes
The processor package land dimension details, base material, plating material and
plating thickness are provided in Appendix C. The following is a list of package Critical-
to-Function (CTF) attributes. CTF values are detailed on the processor package
drawings in Appendix C:
• Package Alignment Length
• Package Alignment Width
• Package Substrate Thickness
•Land Length
• Land Width
• Land True Position (Pattern Relating)
•Land Co-planarity
• Substrate Flatness
2.3.2 Other Processor Package Specific Design Attributes
Refer to Ta b l e C-1 for additional information on package markings, KOZs, tolerances,
parallelism, and tilt. Key package features and design attributes are enumerated below
in Figure 2-4, these include:
• Package Product ID socket keying notch
• Package PHM alignment keying notch
• Package Pin 1 Indicator (shown in Figure 2-5 and Figure 2-6)
Figure 2-4. Processor with Fabric Package Features
and Design Attributes

Intel Xeon Phi Processor x200 Specifications

General

Brand	Intel
Model	Xeon Phi Processor x200
Category	Computer Hardware
Language	English