Intel Xeon Phi Processor x200 User Manual

Table A-2. Example Mechanical Stress Test: Use Condition Environment Definitions
Use
Environment
Speculative Stress Condition
Purpose/Failure
Mec
hanism
Shipping and
Handling
Mechanical Shock
•System-level
• Unpackaged test
•Trapezoidal waveform
• 25 g
• velocity change is based on packaged weight.
• Change in velocity is based upon a 0.5 coefficient of
re
stitution.
12 drops total
•2 drops per each of
3 perpendicular axes
• + and - directions
Mechanical-induced
b
rittle solder joint
failures and TIM
separation/disbond
Product Weight (lbs)
< 20 lbs
20 to > 40
40 to > 80
80 to < 100
100 to < 120
≥120
Non-palletized Product
Velocity Change (in/sec)
250
225
205
175
145
125
Random Vibration
•System-level
• Unpackaged test
• 5 Hz to 500 Hz
—0.001 g
2
/Hz @ 5Hz,
— ramping to 0.01 g
2
/Hz @20 Hz;
— constant value of 0.01 g
2
/Hz from 20 to 500 Hz
• Random control limit tolerance is ± 3 dB
• Power Spectral Density (PSD) Profile: 2.20 g RMS
per system total
• 10 min/axis
•3 axes
Example mechanisms
i
nclude cyclic
mechanical fatigue
stress and TIM
separation/disbond

Quality and Reliability Requirements
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
54
Note: Need to pass customer visual, thermal, mechanical, and electrical requirements.
A.1.1 Customer Environmental Reliability Testing
The conditions of the tests outlined here may differ from the customers’ system
requirements. Board/system level requirements are to be identified and performed by
customers planning on using the Intel reference thermal/mechanical solution.
A.1.2 Socket Durability Test
The socket must withstand 30 mating cycles. Test per EIA-364, test procedure 09.
Measure contact resistance when mated in 1st and 30th cycles. The package must be
removed at the end of each de-actuation cycle and reinserted into the socket.
A.1.3 Intel Reference Component Validation
Intel tests reference components individually and as an assembly on mechanical test
boards and assesses performance to the envelopes specified in previous sections by
varying boundary conditions.
While component validation shows a reference design i
s tenable for a limited range of
conditions, customers need to assess their specific boundary conditions and perform
reliability testing based on their use conditions.
Intel reference components are also used in board functional tests to assess
performance for
specific conditions.

Intel Xeon Phi Processor x200 Specifications

General

Brand	Intel
Model	Xeon Phi Processor x200
Category	Computer Hardware
Language	English