Need help?Do you have a question about the Intel E7500 and is the answer not in the manual?
General| Processor Number | E7500 |
|---|---|
| Number of Cores | 2 |
| Number of Threads | 2 |
| Base Frequency | 2.93 GHz |
| Bus Speed | 1066 MHz |
| TDP | 65 W |
| Socket | LGA775 |
| Core Architecture | Wolfdale |
| Manufacturing Process | 45 nm |
| Instruction Set | 64-bit |
| Virtualization Technology | Yes |
| Integrated Graphics | No |
| Cache | 3 MB |
Illustrates the design process and tools for developing a thermal solution.
Provides definitions for key terms like BGA, MCH, FC-BGA, Tcase, and TDP.
Lists supporting documents and datasheets for related Intel components and standards.
Specifies maximum Tcase and TDP for E7500/E7505 MCH, recommending heatsinks.
Specifies maximum die temperatures required for proper operation and reliability.
Guidelines for accurately measuring MCH die temperatures, focusing on Tcase.
Describes software for simulating chipset thermal performance under worst-case conditions.
Defines design conditions: max local-ambient temp 50°C, min airflow 200 lfm.
Outlines height, width, and depth constraints for MCH thermal solutions.
Describes the passive extruded heatsink assembly using clips and anchors.
Provides recommendations for reliability testing criteria and evaluation.
To Next Page