Intel E7500 User Manual

Reference Thermal Solutions
R
Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide 25
6.3.1 Heatsink Orientations
To enhance the efficiency of the reference thermal solution, it is important for the designer to
orient the fins properly with respect to the mean airflow direction. Simulation and experimental
evidence have shown that the MCH heatsink thermal performance is enhanced when the fins are
aligned with the mean airflow direction (Figure 11). Aligning the heatsink 45° relative to the
airflow is acceptable but delivers reduced thermal performance.
Figure 11. Preferred Heatsink Orientation
heatsk_orient
Orthogonal
Mean Air Flow
Direction
Parallel Mean
Air Flow
Direction
Fin
Orientation
Incorrect
Correct

Intel E7500 Specifications

General

Processor Number	E7500
Number of Cores	2
Number of Threads	2
Base Frequency	2.93 GHz
Bus Speed	1066 MHz
TDP	65 W
Socket	LGA775
Core Architecture	Wolfdale
Manufacturing Process	45 nm
Instruction Set	64-bit
Virtualization Technology	Yes
Integrated Graphics	No
Cache	3 MB