Intel E7500 User Manual

Reference Thermal Solutions
R
Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide 23
6.3 Thermal Solution Assembly
The reference thermal solution is a passive extruded heatsink with thermal and mechanical
interfaces. It is attached using a clip with each end hooked through an anchor soldered to the
board. Figure 8 shows the reference thermal solution assembly and associated components.
Figure 9 and Figure 10 show alternate views of the reference solution. Full mechanical drawings of
the thermal solution assembly and the heatsink clip are provided in Appendix B. Appendix A
contains vendor information for each thermal solution component.
Figure 8. Reference Thermal Solution Assembly
FC-BGA
Mechanical
A
nchored
Solde
r
-Down
Thermal
Heatsin
ref_therm_solution_assy

Intel E7500 Specifications

General

Processor Number	E7500
Number of Cores	2
Number of Threads	2
Base Frequency	2.93 GHz
Bus Speed	1066 MHz
TDP	65 W
Socket	LGA775
Core Architecture	Wolfdale
Manufacturing Process	45 nm
Instruction Set	64-bit
Virtualization Technology	Yes
Integrated Graphics	No
Cache	3 MB