Intel E7500

Thermal Metrology
R
18 Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide
Figure 4. 0 Angle Attach Methodology (Top View)
Cement +
Thermocouple Bead
angle_attach_1
Thermocouple Wire
Die
Substrate
NOTE: Not to scale.
Figure 5. 0° Angle Attach Heatsink Modifications
Angle_Attach_Heatsink_Mod
1.3 mm (0.05 in.)
(0.5 mm (0.02 in.) Depth)
3.3 mm (0.13 in.) Diameter
(1.5 mm (0.06 in.) Depth)
NOTE: Not to scale.