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General| Socket | LGA 1366 |
|---|---|
| TDP | 130W |
| Max Memory Size | 24 GB |
| PCI Express Version | 2.0 |
| Virtualization Technology | Yes |
| Hyper-Threading Technology | Yes |
| Turbo Boost Technology | Yes |
| Memory Types | DDR3-1066 |
Defines key terms and acronyms used in the datasheet for clarity and consistent understanding.
Lists related Intel documents providing additional information on specifications, design guides, and manuals.
Describes the Intel QuickPath Interconnect (QPI) for high-speed serial transfer using differential signaling.
Explains the VID signals used for automatic selection of processor core voltages (VCC).
Details the DC electrical specifications at the processor pads, including voltage and current.
Provides dimensions and tolerances for the processor package, essential for thermal solution design.
Defines areas on the package substrate that must not be intruded by thermal/mechanical solutions.
Provides comprehensive lists of processor lands, ordered by name, with buffer type and direction.
Details the function, type, and description of each processor signal for system integration.
Outlines thermal requirements and guidelines for ensuring reliable processor operation within limits.
Describes features like Adaptive Thermal Monitor (ATM) for managing processor temperature.
Explains the PECI interface for communication with thermal monitoring devices and DTS.
Details hardware-configurable options for initial processor setup and subsequent operation.
Describes processor support for low power states at thread, core, and package levels.
Explains voltage and frequency scaling for optimal performance and power management.
Introduces Intel boxed processors, their target systems, and cooling solution requirements.
Documents mechanical specifications for the boxed processor's cooling solution, including dimensions.
Details cooling requirements for the boxed processor's fan heatsink solution and system integrator responsibilities.
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