Electrical Specifications
22 Datasheet
.
Notes:
1. For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must
be satisfied.
2. Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor.
3. V
TTA
and V
TTD
should be derived from the same VR.
2.11 Processor DC Specifications
The processor DC specifications in this section are defined at the processor
pads, unless noted otherwise. See Chapter 4 for the processor land listings and
Chapter 5 for signal definitions. Voltage and current specifications are detailed in Table
2-7. For platform planning, refer to Table 2-8, which provides V
CC
static and transient
tolerances. This same information is presented graphically in Figure 2-3.
The DC specifications for the DDR3 signals are listed in Table 2-11. Control Sideband
and Test Access Port (TAP) are listed in Table 2-12 through Table 2-15.
Table 2-7 through Table 2-15 list the DC specifications for the processor and are valid
only while meeting specifications for case temperature (T
CASE
as specified in Chapter 6,
“Thermal Specifications”), clock frequency, and input voltages. Care should be taken to
read all notes associated with each parameter.
Table 2-6. Processor Absolute Minimum and Maximum Ratings
Symbol Parameter Min Max Unit Notes
1, 2
V
CC
Processor Core voltage with respect to V
SS
-0.3 1.55 V
V
TTA
Voltage for the analog portion of the integrated
memory controller, QPI link and Shared Cache
with respect to V
SS
—1.35V3
V
TTD
Voltage for the digital portion of the integrated
memory controller, QPI link and Shared Cache
with respect to V
SS
—1.35V3
V
DDQ
Processor I/O supply voltage for DDR3 with
respect to V
SS
— 1.875 V
V
CCPLL
Processor PLL voltage with respect to V
SS
1.65 1.89 V
T
CASE
Processor case temperature See
Chapter 6
See
Chapter 6
°C
T
STORAGE
Storage temperature See
Chapter 6
See
Chapter 6
°C
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