Intel Core i7 Extreme Edition

Datasheet 3
Contents
1Introduction..............................................................................................................9
1.1 Terminology .....................................................................................................10
1.2 References .......................................................................................................11
2 Electrical Specifications...........................................................................................13
2.1 Intel® QPI Differential Signaling .........................................................................13
2.2 Power and Ground Lands....................................................................................13
2.3 Decoupling Guidelines........................................................................................13
2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling.........................................................14
2.4 Processor Clocking (BCLK_DP, BCLK_DN) .............................................................14
2.4.1 PLL Power Supply...................................................................................14
2.5 Voltage Identification (VID) ................................................................................14
2.6 Reserved or Unused Signals................................................................................17
2.7 Signal Groups...................................................................................................18
2.8 Test Access Port (TAP) Connection.......................................................................19
2.9 Platform Environmental Control Interface (PECI) DC Specifications...........................20
2.9.1 DC Characteristics..................................................................................20
2.9.2 Input Device Hysteresis ..........................................................................21
2.10 Absolute Maximum and Minimum Ratings.............................................................21
2.11 Processor DC Specifications ................................................................................22
2.11.1 DC Voltage and Current Specification........................................................23
2.11.2 VCC Overshoot Specification....................................................................29
2.11.3 Die Voltage Validation.............................................................................30
3 Package Mechanical Specifications ..........................................................................31
3.1 Package Mechanical Drawing...............................................................................31
3.2 Processor Component Keep-Out Zones.................................................................34
3.3 Package Loading Specifications ...........................................................................34
3.4 Package Handling Guidelines...............................................................................34
3.5 Package Insertion Specifications..........................................................................34
3.6 Processor Mass Specification...............................................................................35
3.7 Processor Materials............................................................................................35
3.8 Processor Markings............................................................................................35
3.9 Processor Land Coordinates................................................................................36
4Land Listing.............................................................................................................37
5 Signal Definitions ....................................................................................................73
5.1 Signal Definitions ..............................................................................................73
6 Thermal Specifications ............................................................................................77
6.1 Package Thermal Specifications...........................................................................77
6.1.1 Thermal Specifications............................................................................77
6.1.2 Thermal Metrology .................................................................................81
6.2 Processor Thermal Features................................................................................82
6.2.1 Processor Temperature ...........................................................................82
6.2.2 Adaptive Thermal Monitor........................................................................82
6.2.3 THERMTRIP# Signal ...............................................................................85
6.3 Platform Environment Control Interface (PECI)......................................................85
6.3.1 Introduction ..........................................................................................85
6.3.2 PECI Specifications.................................................................................87
6.4 Storage Conditions Specifications ........................................................................88
7Features..................................................................................................................89
7.1 Power-On Configuration (POC)............................................................................89