Intel Core i7 Extreme Edition User Manual

4 Datasheet
7.2 Clock Control and Low Power States.....................................................................89
7.2.1 Thread and Core Power State Descriptions .................................................90
7.2.2 Package Power State Descriptions.............................................................91
7.3 Sleep States .....................................................................................................92
7.4 ACPI P-States (Intel
®
Turbo Boost Technology) .....................................................92
7.5 Enhanced Intel SpeedStep
®
Technology ...............................................................93
8 Boxed Processor Specifications................................................................................95
8.1 Introduction......................................................................................................95
8.2 Mechanical Specifications....................................................................................96
8.2.1 Boxed Processor Cooling Solution Dimensions.............................................96
8.2.2 Boxed Processor Fan Heatsink Weight .......................................................98
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....98
8.3 Electrical Requirements ......................................................................................98
8.3.1 Fan Heatsink Power Supply ......................................................................98
8.4 Thermal Specifications........................................................................................99
8.4.1 Boxed Processor Cooling Requirements......................................................99
8.4.2 Variable Speed Fan...............................................................................101
Figures
1-1 High-Level View of Processor Interfaces................................................................. 9
2-1 Active ODT for a Differential Link Example ............................................................13
2-2 Input Device Hysteresis......................................................................................21
2-3 VCC Static and Transient Tolerance Load Lines ......................................................25
2-4 VTT Static and Transient Tolerance Load Line ........................................................27
2-5 VCC Overshoot Example Waveform......................................................................30
3-1 Processor Package Assembly Sketch.....................................................................31
3-2 Processor Package Drawing (Sheet 1 of 2) ............................................................32
3-3 Processor Package Drawing (Sheet 2 of 2) ............................................................33
3-4 Processor Top-Side Markings...............................................................................35
3-5 Processor Land Coordinates and Quadrants (Bottom View)......................................36
6-1 Processor Thermal Profile....................................................................................79
6-2 Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location..........81
6-3 Frequency and Voltage Ordering..........................................................................83
7-1 Power States.....................................................................................................90
8-1 Mechanical Representation of the Boxed Processor .................................................95
8-2 Space Requirements for the Boxed Processor (side view) ........................................96
8-3 Space Requirements for the Boxed Processor (top view) .........................................97
8-4 Space Requirements for the Boxed Processor (overall view) ....................................97
8-5 Boxed Processor Fan Heatsink Power Cable Connector Description............................98
8-6 Baseboard Power Header Placement Relative to Processor Socket.............................99
8-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view)...............100
8-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view)..............100
8-9 Boxed Processor Fan Heatsink Set Points ............................................................101

Intel Core i7 Extreme Edition Specifications

General

Socket	LGA 1366
TDP	130W
Max Memory Size	24 GB
PCI Express Version	2.0
Virtualization Technology	Yes
Hyper-Threading Technology	Yes
Turbo Boost Technology	Yes
Memory Types	DDR3-1066