Intel Xeon Phi Processor x200 User Manual

Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
55

Quality and Reliability Requirements
A.2 Ecological Requirement
General requirements: Materials used in this product comply with Intel’s Environmental
Product Content Specification for Suppliers and Outsourced Manufacturers.
Materials should be resistant to fungal growth. Examples of non-resistant materials
include cellulose materials, animal- and vegetable-based adhesives, grease, oils, and
many hydrocarbons. Synthetic materials such as PVC formulations, certain
polyurethane compositions (for example, polyester and some polyethers), plastics
which contain organic fillers of laminating materials, paints, and varnishes also are
susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-
STD-810E, Method 508.4 must be performed to determine material performance.
Cadmium should not be used in the painting or plating of the socket. CFCs and HFCs
should not be used in manufacturing the socket.
Any plastic component exceeding 25 grams must be recyclable per the European Blue
Angel recycling standards.
Supplier is responsible for complying with industry standards regarding environmental
care as well as with the specific standards required per supplier's region. More
specifically, supplier is responsible for compliance with the European regulations related
to restrictions on the use of Lead and Bromine containing flame-retardants. Legislation
varies by geography, European Union (RoHS/WEEE), China, California, and so forth.
The following definitions apply to the use of the terms lead-free, Pb-free, and
Restriction of Hazardous Substances (RoHS) compliant.
Halogen flame retardant free (HFR-Free) PCB: Current guidance for the socket
pad layout supports FR4 and HFR-Free designs. In future revisions of this document,
Intel may provide guidance on the mechanical impact to using a HFR-free laminate in
the PCB. This will be limited to workstations.
Lead-free and Pb-free: Lead has not been intentionally added, but lead may still
exist as an impurity below 1000 ppm.
RoHS compliant: Lead and other materials banned in RoHS Directive are either (1)
below all applicable substance thresholds as proposed by the EU or (2) an approved/
pending exemption applies.
Note: RoHS implementation details are not fully defined and may change.
Additional requirements: Cadmium should not be used in painting or plating. No
Quaternary salt electrolytic capacitors should be used. Examples of prohibited caps are:
United Chemi-Con* type: LXF, LXY, LXZ. No brominated plastics should be used. Also,
plastics heavier than 25 g must be labeled per ISO 10469 and may not contain
halogenated flame retardant compounds.
Chemical Restrictions:
The components must be “halogen-free,” that is, they are assembled without the
intentional use of halogen in the raw materials and these elements are not intentionally
present in the end product.
• IEC 61249-2-21
— 900 ppm maximum chlorine
— 900 ppm maximum bromine
— 1500 ppm maximum total halogens

Intel Xeon Phi Processor x200 Specifications

General

Architecture	Knights Landing
Process Technology	14nm
Base Clock Speed	1.3 GHz - 1.5 GHz
Turbo Boost Clock Speed	1.7 GHz
Memory Support	DDR4
Max Memory	384 GB
Memory Speed	2400 MHz
Memory Channels	6
Integrated Memory Controller	Yes
Instruction Set Extensions	AVX-512
PCI Express Lanes	36
Socket	LGA 3647
TDP	215 W
L1 Cache	32 KB per core

Summary

Processor Mechanical Design

2.1 Processor Package Mechanical Specifications

Overview of processor package mechanical design and integration, serving as the primary interface.

2.2 Processor Package Description

Details the multi-chip package, including LGA3647-1 socket interface and IHS.

2.3 Package Mechanical Dimensions

Provides processor package dimensions and tolerances, including IHS and fabric extension details.

2.3.1 Package Critical-to-Function Attributes

Lists package land dimension details, base material, plating and plating thickness.

Socket Mechanical Design

3.1 LGA3647-1 Socket Overview

Describes the SMT LGA socket for the processor, its components, and features.

3.1.1 Socket Features

Lists LGA3647-1 socket attributes, including pin grid geometry and solder ball characteristics.

3.1.2 Socket Mechanical Requirements

Details socket attachment methods and testing against mechanical shock and vibration.

3.1.2.2 Socket Loading and Deflection Specifications

Provides loading and board deflection specs for the LGA3647-1 socket.

3.2 Socket Critical-to-Function Interfaces

Lists CTF attributes for main board layout and component interface to the socket.

3.3.3 Socket-Package Contact Characteristics

Details contact count, layout, base material, plating, and paddle specifications.

3.3.3.1 Contact/Pad Mating Location

Defines offset between LGA land center and solder ball center for contact alignment.

3.3.3.2 Contact Load-Deflection Curve

Describes contact design for adequate normal force and meeting performance targets.

Retention Assembly Mechanical Design

4.1 Mechanical Retention Assembly

Describes the spring-loading mechanism for processor retention to the main board and heatsink.

4.1.1 Backplate

Details the backplate's role in structural rigidity, solder joint reliability, and material.

4.1.2 Bolster Plate with Spring

Describes the integrated subassembly with guiding posts, springs, and nuts for retention.

4.1.3 Processor Package Carrier

Details the carrier as part of PHM, its function in holding the processor and attaching to heatsink.

4.1.4 Heatsink

Specifies heatsink solution volume, material, and integration into the PHM.

4.2 Mechanical Load Specifications

Defines bolster and back plates to meet socket loading and PHM support during shock/vibration.

4.3 Heatsink Mechanical Requirements

Lists heatsink mass limits, stiffness, flatness, and base thickness attributes.

Board and System Design Guidelines

5.1 Mechanical Design Considerations

Covers retention assembly design, reference thermal solution, and validation criteria.

5.2 Printed Circuit Board (PCB) Design Considerations

Covers allowable board thickness, reference board layout, and board keep-outs.

Thermal Specifications and Design Guidelines

6.1 Thermal Specification Overview

Explains MCP thermal requirements, interface to thermal solution, and system-level cooling.

6.1.1 Thermal Design Power (TDP) and TCASE Specifications

Lists TDP and TCASE values for different processor SKUs under various workloads.

6.1.2 Case Temperature Geometry and Influence Factors

Discusses monitoring die temperatures, IHS TCASE specs, and measurement locations.

Figure 6-1. Processor Package Thermocouple Locations, Top view

Illustrates thermocouple locations on the processor package IHS for TCASE measurement.

Table 6-3. Processor TCASE Influence Parameters

6.1.3 Socket Maximum Temperature

Defines socket maximum temperature, via temperature guidance, and measurement methods.

6.1.6 Reference Thermal Solution Performance Targets

6.2 Thermal Design and Management Guidelines

Covers system thermal environmental conditions, including ambient temperature and airflow.

6.2.1 System Thermal Environmental Conditions

6.2.2 Thermal Solution Performance Characterization

6.2.4 Thermal Management Guidelines

Addresses compliance with TCASE targets, fan speed control, and thermal excursion power.

Quality and Reliability Requirements

A.1 Thermal/Mechanical Solution Stress Test

Details reliability performance evaluation using use conditions and acceleration models.