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Intel Xeon Phi Processor x200 User Manual

Intel Xeon Phi Processor x200
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Figure E-25. Bolster Plate, M3 Captive Nut
A A
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
B
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
.2 A B
.2 A
CLEARANCE HOLE 2.0 0.25 7
4.32+0/-0.25 X120
3.1
+0.2
-0.1
4.5 0.05
2.69±0.08
1.51±0.08
6 0.05
0.5±0.05
8 0.12
A
H19328 1 11
DWG. NO SHT. REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 14:1
11H19328D
REV
DRAWING NUMBER
SIZE
SOCKET P M3 BOLSTER CAPTIVE NUT
TITLE
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
--
DATEAPPROVED BY
-
9/10/2013
DATECHECKED BY
9/10/2013
DATEDRAWN BY
8/8/2013
DATEDESIGNED BY
DIMENSIONS ARE IN MILLIMETERS
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBER
ITEM NO
QTY
SOCKET P M3 BOLSTER CAPTIVE NUTH19328-002TOP
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPR
- 01 TOOLING RELEASE 9/10/2013
02 UPDATED NOTE 2 AND 6. 12/10/14
03 REMOVED NOTE REGARDING DIMENSIONS ARE CRITICAL TO FUNCTION. 3/26/15
04
1. ROLLED PART NUMBER FROM -001 TO -002.
2. CHANGED GEOMETRY.
4/15/15
05 1. ADDED NOTE 8 TO CALL OUT CRITICAL TO FUNCTION DIMENSIONS. 4/23/15
06 1. THREAD CALLOUT ON BOTTOM VIEW ADDED. 5/1/15
PG1 8B 07 1. REMOVED CTF CALLOUT FOR INTERNAL THREAD NOTE. 5/21/15
B-3 08 1. UPDATED NOTE 5 TO CALLOUT -004 COLLAR 8/28/15
B6
C6
B7
09
1. REMOVED FLATNESS CALLOUT
2. REMOVED FEATURE CONTROL FRAME
3. DELETED DUPLICATE DIMENSIONING
10/15/15
B8
C6
10
1. INCREASED TOLERANCE RANGE FROM 0.04 TO 0.08.
2. INCREASED TOELRANCE RANGE FROM +/-0.1 TO +0.2/-0.1
2/11/16
B6 11 1. REMOVED TWO CTF DIMENSIONS. 7/11/16
NOTES UNLESS OTHERWISE SPECIFIED
1. REFERENCE DOCUMENTS
ASME Y14.5M - 2009 - STANDARD DIMENSION AND TOLERANCES
UL1439 - UL SHARP EDGE TESTING
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY
3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED:
(BASIC DIMENSIONS FROM THE 3D CAD MODEL).
3. MATERIAL:
-LOW CARBON STEEL 1144, HARDEN AND TEMPER
-CRITICAL MECHANICAL PROPERTIES: 345 MPa MIN YIELD STRENGTH
-MAY USE INTEL ENGINEERING APPROVED EQUIVALENT
4. FINISH:
-2 MICROMETER MIN ELECTROLYTIC NICKEL PLATING
-PROCESS TEST 168 HRS 85 DEGREE C / 85% HUMIDITY WITH NO
VISIBLE CORROSION
5 INTERFERENCE FIT WITH PART H19329-003.
MINIMUM 50LBF SEPARATION FORCE WITH PRESS FIT COLLAR
6. SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.1MM
RADIUS MAX
7 DRILL CLEARANCE HOLE TO CLEAN UP CHIP/BURRS FROM TAPPING
& FORMING OPERATIONS, SHOULD ALLOW M3 STUD TO PASS THROUGH
WITHOUT INTERFERENCE
8. DIMENSIONS MARKED ARE CRITICAL TO FUNCTION
DIMENSIONS (CTF).
6 POINT T-20 DRIVE FEATURE 1.5 0.25
SECTION A-A
5
M3 X 0.5 CLASS 6H
INTERNAL THREAD THRU ALL
C
Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
97
Retention Assembly Mechanical Drawings

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Intel Xeon Phi Processor x200 Specifications

General IconGeneral
BrandIntel
ModelXeon Phi Processor x200
CategoryComputer Hardware
LanguageEnglish

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