Processor Mechanical Design
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
14
These conceptual figures are not drawn to scale, and important design details may
have changed (e.g., keying). The Pin 1 fiducial can be seen in the lower-right corner of
these figures. Refer to Appendix C for the latest details on package dimensions and
features.
2.3 Package Mechanical Dimensions
The processor package is 76 x 60.5 mm (outside dimensions) and approximately 4.3
mm thick (bottom side of substrate to top of IHS, not including the Land Side
Capacitors [LSCs]). The processor with fabric package is similar in size, but includes a
25 mm wide extension centered on one edge; the extension protrudes out roughly 21
mm and provides gold-finger contacts for fabric cable connection.
Figure 2-3 shows a photograph of the IHS on a processor.
Figure 2-3. Processor with the Integrated Heat Spreader
Notes:
1. The hole in the IHS above allows for outgassing during TIM material c
uring. A second hole is added to the
processor with fabric IHS to assist with substrate alignment.
2. The Pin 1 fiducial is shown in the lo
wer-right corner of this figure.
The processor package mechanical drawings are provided in Appendix C. These
processor package mechanical drawings include dimensions necessary to design a
thermal solution for the processor, including:
• Package dimensions and tolerances (height, length, width, etc.)
• IHS dimensions and tolerances
• IHS parallelism, flatness, and tilt
•Land dimensions
• Fabric package extension dimensions (processor with fabric only)
• Reference datum
The processor connects to the main board through a surface-mount-type LGA socket. A
description
of the socket can be found in Section 3 and socket drawings are provided in
Appendix D.
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