Socket Mechanical Design
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
26
assembly location. The mark is placed on a surface that is visible after the socket
has been mounted on the main board, with bolster plate assembly and pick-and-
place cap installed. In addition, this identification code is marked on the exterior of
the box in which the unit is shipped. The preferred font type is Helvetica Bold [min
4 pt, or 1.5 mm].
This mark may be laser-marked.
• Visual Aids - The socket will have Pin A1 and package/socket alignment keys.
3.3.3 Socket-Package Contact Characteristics
• Contact Count - The total number of top-side contacts is 3647.
• Layout - The contacts are laid out in two “C” shaped regions opposing each other as
shown in Figure 3-5. The arrows in the figure indicate the wiping orientation of the
contacts in the two regions to be 60° about the horizontal axis. There are 1823 and
18
24 contacts in the right and left halves of the socket, respectively.
Figure 3-5. LGA3647-1 Socket Contact Orientation
• Contact Base Material - High-strength copper alloy.
• Contact Area Plating - For the area on the socket contacts where the processor
lands will mate, there are two SKUs: One with 0.381
m [15 inches] and one with
0.762
m [30 inches] minimum gold plating thickness, both versions are over a
1.27 m [50 inches] minimum nickel under-plating in critical contact areas (area
on socket contacts where processor lands will mate) is required. No contamination
by solder in the contact area is allowed during solder reflow.
• Paddle - If a paddle is used, the paddle area should be nickel plated to a minimum
nickel thickness of 1.27
m [50 inches]. The paddle should have sufficient
compliance to assure the solder joint reliability under the load conditions in
Tabl e 3-2.
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