Intel Xeon Phi Processor x200

Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
71

Retention Assembly Mechanical Drawings
E Retention Assembly
Mechanical Drawings
Ta b le E-1 lists the mechanical drawings included in this appendix.
Table E-1. Mechanical Drawing List (Sheet 1 of 2)
Description Figure
Backplate Assembly, 1/3 Figure E-1
Backplate Assembly, 2/3 Figure E-2
Backplate Assembly, 3/3 Figure E-3
Bolster Plate Assembly and Dust Cover Figure E-4
Bolster Plate Assembly, 1/2 Figure E-5
Bolster Plate Assembly, 2/2 Figure E-6
Heatsink Module Clip (non-Fabric), 1/2 Figure E-7
Heatsink Module Clip (non-Fabric), 2/2 Figure E-8
Heatsink Module Clip (Fabric), 1/2 Figure E-9
Heatsink Module Clip (Fabric), 2/2 Figure E-10
Backplate Figure E-11
Backplate Insulator Figure E-12
Back Plate, M3 Stud Figure E-13
Bolster Plate, 1/2 Figure E-14
Bolster Plate, 2/2 Figure E-15
Bolster Plate, Insulator Figure E-16
Bolster Plate, Small Guide Post Figure E-17
Bolster Plate, Large Guide Post Figure E-18
Bolster Plate, LEC Guide Pin Figure E-19
Bolster Plate, Corner Standoff Figure E-20
Bolster Plate, Spring Assembly Figure E-21
Bolster Plate, Spring Figure E-22
Bolster Plate, Spring Stud, M4 Figure E-23
Bolster Plate, Spring Rivet Figure E-24
Bolster Plate, M3 Captive Nut Figure E-25
Bolster Plate, M3 Captive Nut Collar Figure E-26
Socket-P, Dust Cover, 1/2 Figure E-27
Socket-P, Dust Cover, 2/2 Figure E-28
1U Heatsink Assembly, 1/2 (Reference Only) Figure E-29
1U Heatsink Assembly, 2/2 (Reference Only) Figure E-30
1U Heatsink, 1/2 (Reference Only) Figure E-31
1U Heatsink, 2/2 (Reference Only) Figure E-32
1U Heatsink, Label (Reference Only) Figure E-33