Intel Xeon Phi Processor x200

Figure E-3. Backplate Assembly, 3/3
13
4
5678
B C D
A
123
4
5678
B C D
A
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
R
A
(0.25)
H77469 3 09
DWG. NO SHT. REV
SHEET 3 OF 3
DO NOT SCALE DRAWING
SCALE: 2:1
09H77469D
REV
DRAWING NUMBER
SIZE
DEPARTMENT
BOTTOM SIDE (NON-INSULATOR SIDE)
NO METAL CAN BE EXPOSED. OVERHANG OF INSULATOR ON INNER AND OUTER EDGES OF THE BACKPLATE IS ACCEPTABLE.
PIN 1 MARKING 3
PART MARKING ZONE 3
C
Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
75

Retention Assembly Mechanical Drawings