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Intel Xeon Phi Processor x200 User Manual

Intel Xeon Phi Processor x200
114 pages
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Figure F-3. Processor Heatsink Module Backplate Keep-Out Zone
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
3.268
[83]
4.331
[110]
2X .197
[5]
1.220
[31]
2X .512
[13]
.951
[24.15]
4X .360
[9.14]
4X .300
[7.62]
1.011
[25.67]
2.145
[54.48]
3.176
[80.68]
2X .197
[5]
.417
[10.6]
.477
[12.12]
.988
[25.1]
.724
[18.4]
32X R.039
[1]
(ALL INTERNAL CORNERS)
4X R.039
[1]
KOZ_H17716_KNL-PHM-BACKPLATE 1 01
DWG. NO SHT. REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 2:1
01KOZ_H17716_KNL-PHM-BACKPLATED
REV
DRAWING NUMBER
SIZE
LGA-3647 KOZ, KNL PHM BACKPLATE
TITLE
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
-
DATEAPPROVED BY
-
-
DATECHECKED BY
7/19/13
DATEDRAWN BY
7/11/13
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN INCHES [MM]
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBER
ITEM NO
QTY
LGA-3647 KOZ, KNL PHM BACKPLATEKOZ_H17716_KNL-PHM-BACKPLATETOP
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPR
- 01 UPDATED G93734 TO SEPERATE KOZ'S: TOPSIDE, BACKPLATE, HOLES 7/19/13
NOTES:
1. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2. CENTERLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE PHM HOLE PATTERN FOR PROPER
PHM AND SOCKET FUNCTION.
3 A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE
SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT
DEFINED BY THAT ZONE AFTER REFLOW.
UNLESS OTHERWISE NOTED ALL VIEW DIMENSIONS ARE NOMINAL. ALL HEIGHT RESTRICTIONS ARE
MAXIMUMS. ZONES ARE NOT DRIVEN BY SPECIFIC OR IMPLIED TOLERANCES.
A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE OF THE MOTHERBOARD
AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING SOLDER BUMPS.
SEE 4 FOR ADDITIONAL DETAILS.
4 ASSUMING A GENERIC MAXIMUM COMPONENT HEIGHT ZONE.
CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE MUST INCLUDE:
- COMPONENT NOMINAL HEIGHT
- COMPONENT TOLERANCES
- COMPONENT PLACEMENT TILT
- SOLDER RELOW THICKNESS
DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED THE SPECIFIED MAXIMUM HEIGHT.
SECONDARY SIDE OF MOTHERBOARD
AS VIEWED FROM THE SECONDARY SIDE
SEE DETAIL A
7X MOTHERBOARD THROUGH HOLES
FOR REFERENCE ONLY,
FOR DETAILS SEE DOCUMENT
KOZ_H17715_KNL-PHM-MTG-HOLES
2X ASSUMED COMPONENT PLACEMENT
WINDOWS FOR PRELIMINARY KNL STUDIES
FINAL REQUIREMENTS TBD.
PIN 1 LOCATION
FOR REFERENCE ONLY
SCALE 5:1
DETAIL A
KOZ LEGEND
BACKPLATE ZONE,
NO OTHER COMPONENT PLACEMENT ALLOWED,
0.0 MM HEIGHT RESTRICTION
SECONDARY SIDE SOCKET CAVITY
AND COMPONENT ZONES,
1.8 MM MAX COMPONENT HEIGHT 4
Mechanical KOZs
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
114

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Intel Xeon Phi Processor x200 Specifications

General IconGeneral
BrandIntel
ModelXeon Phi Processor x200
CategoryComputer Hardware
LanguageEnglish

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