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Intel Xeon Phi Processor x200 User Manual

Intel Xeon Phi Processor x200
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Figure E-17. Bolster Plate, Small Guide Post
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
B
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
.1 A
.05 B A
.2 A B
3.5 0.1
3.0 MAX 7
20±0.25
A
G93935 1 08
DWG. NO SHT. REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 9:1
08G93935D
REV
DRAWING NUMBER
SIZE
KNL BOLSTER SMALL GUIDE POST
TITLE
DEPARTMENT
SEE NOTESSEE NOTES
FINISHMATERIAL
-
DATEAPPROVED BY
9/11/15
DATECHECKED BY
8/16/13
DATEDRAWN BY
8/16/13
DATEDESIGNED BY
DIMENSIONS ARE IN MILLIMETERS
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPR
- 01 TOOLING RELEASE 9/5/14
7A 02
1. ADDED TAPER TO POST. ROLLED PART NUMBER TO -002.
2. CHANGED POST DIAMETER FROM 4.5MM TO 3.5MM.
3. CHANGED POST BOTTOM INTERFACE DIAMETER FROM 3MM TO 2.5MM
4. UPDATED NOTE 2 AND ADDED NOTE 7.
12/10/14
A3
ALL
B3
03
1. REVISED PART NUMBER TO -003.
2. REMOVED BASE TAPER.
3. REMOVED NOTE 4 AND 6.
03/25/15
04
1. REMOVED 8MM AND 2.17MM DIMENSIONS.
2. INCREASED TOLERANCE FROM .1 TO .25MM ON 20MM DIMENSION
04/15/15
3-B 05 1. ADD NOTE 6 TO CALL OUT CRITICAL TO DIMENSIONS. 4/23/15
6-A
2-B
06
1. CHANGED DIMENSION TO STATE MAX 3.0 AND CALLOUT #7 SYMBOL
2. ADDED NOTE 7 TO CALLOUT REQUIRED PUSH OUT FORCE.
3. ADDED GD & T FEATURE CONTROL FRAMES
8/28/15
B-6 07 1. ADDED OPTIONAL CHAMFER/RADIUS TO AID IN ASSEMBLY OF PART. 10/01/15
C-7
C-7
08
1. CHANGED FEATURE CONTROL FRAME DIMENSION FROM 0 TO 0.1.
2. CHANGED FEATURE CONTROL FRAME SYMBOL FROM TRUE POSTION TO
PERPENDICULARITY
10/15/15
NOTES: UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-2009 - STANDARD DIMENSION AND TOLERANCES
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED TOLERANCE
SHALL BE CONTROLLED BY 3D CAD DATABASE. FOR FEATURES NOT EXPLICITLY TOLERANCED:
(BASIC DIMENSIONS FROM THE 3D CAD MODEL).
3. DIMENSIONS ARE IN MILLIMETERS
4. MATERIAL: 18-8 STAINLESS STEEL; AISI 303, 304, 305; JIS SUS304; OR EQUIVALENT
5. PROCESS TEST: 168 HRS 85
C / 85% HUMIDITY WITH NO VISIBLE CORROSION.
6. DIMENSIONS MARKED ARE CRITICAL TO FUNCTION DIMENSIONS (CTF).
7 SUPPLIER DEFINED DIAMETER TO MEET PRESS FIT SEPARATION FORCE REQUIREMENT.
SEE APPLICABLE BOLSTER PLATE ASSEMBLY DRAWING.
- PUSHOUT FORCE > 89N (20LBF)
CHAMFER TO CORNER (MAX 1.0 HEIGHT) OR 1.0MM
RADIUS MAX CAN BE ADDED AS AND OPTION
FOR STRUCTURAL INTEGRITY DURING ASSEMBLY
C
C
PARTS LIST
DESCRIPTIONPART NUMBER
ITEM NO
QTY
KNL BOLSTER SMALL GUIDE POSTG93935-003TOP
Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
89
Retention Assembly Mechanical Drawings

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Intel Xeon Phi Processor x200 Specifications

General IconGeneral
BrandIntel
ModelXeon Phi Processor x200
CategoryComputer Hardware
LanguageEnglish

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