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General| Processor Type | Xeon |
|---|---|
| Socket | LGA 771 |
| Lithography | 65 nm |
| Chipset Category | Server |
| Memory Channels | 4 |
| ECC Support | Yes |
| Integrated Graphics | No |
| Process Technology | 65 nm |
| Virtualization Technology | Yes |
| Release Date | 2007 |
| Architecture | Core |
| Supported CPU | Dual-Core and Quad-Core Xeon |
| FSB | 1333 MHz/1600 MHz |
| Memory Type | FB-DIMM |
| Model | 5400 Series |
| Number of Threads | 4 |
| L2 Cache | 2 x 6 MB |
| Memory Support | DDR2 FB-DIMM |
| Instruction Set | 64-bit |
| Number of Cores | Quad-Core |
Defines the purpose of this guide for the Quad-Core Intel® Xeon® Processor 5400 Series.
Provides definitions for key terms used in thermal and mechanical design.
Outlines mechanical performance criteria for processor cooling solutions.
Discusses thermal control, sensors, and TDP for processor thermal management.
Defines the relationship between processor case temperature and power consumption.
Explains heatsink design considerations, including surface area and conduction path.
Compares reference thermal solutions' performance against specified thermal profiles.
Shows the thermal performance and pressure drop characteristics of the 1U alternative heatsink.
Details how to prepare the heatsink base with load cells for testing.
Outlines testing for clip load degradation under thermal bake conditions.
Specifies safety standards for heatsink and attachment assemblies.
Covers testing of heatsinks under environmental conditions and stress tests.
Addresses material properties, fungal resistance, and recycling standards.
Identifies suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series reference solution.
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