Intel 5400 Series User Manual

Thermal/Mechanical Reference Design
42 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
2.5.6 Thermal Profile Adherence
The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A
for the Quad-Core Intel® Xeon® Processor 5400 Series. From Tab le 2-4 , the three-
sigma (mean+3sigma) performance of the thermal solution is computed to be 0.187
°C/W and the processor local ambient temperature (T
LA
) for this thermal solution is 40
°C. Hence, the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-8.y = 0.187*X + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Figure 2-19 below shows the comparison of this reference thermal solution’s Thermal
Profile to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile A
specification. The 2U+ CEK solution meets the Thermal Profile A with a 0.6°C margin at
the upper end (TDP). By designing to Thermal Profile A, it is ensured that no
measurable performance loss due to TCC activation is observed under the given
environmental conditions.
Figure 2-18. 1U CEK Heatsink Thermal Performance

Intel 5400 Series Specifications

General

Processor Type	Xeon
Socket	LGA 771
Lithography	65 nm
Chipset Category	Server
Memory Channels	4
ECC Support	Yes
Integrated Graphics	No
Process Technology	65 nm
Virtualization Technology	Yes
Release Date	2007
Architecture	Core
Supported CPU	Dual-Core and Quad-Core Xeon
FSB	1333 MHz/1600 MHz
Memory Type	FB-DIMM
Model	5400 Series
Number of Threads	4
L2 Cache	2 x 6 MB
Memory Support	DDR2 FB-DIMM
Instruction Set	64-bit
Number of Cores	Quad-Core