Intel 5400 Series User Manual

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 55
1U Alternative Heatsink Thermal/Mechanical Design
x = Processor power value (W)
Figure A-3 below shows the comparison of this reference thermal solution’s Thermal
Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile
specification. The 1U alternative solution meets the Thermal Profile with 0.5°C margin
at the upper end (TDP). By designing to Thermal Profile, it is ensured that no
measurable performance loss due to TCC activation is observed under the given
environmental conditions.
§
Figure A-3. 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®
Processor L5400 Series Thermal Profile
35
40
45
50
55
0510
15
20 25 30 35 40
45
50
55
60 65 70 75 80
Tcase (
C
)
T
CASE_MAX
@ TDP
1U Alternative Heatsink
Y = 0.331 * X + 40
Thermal Profile
Y = 0.298 * X + 43.2
60
65

Intel 5400 Series Specifications

General

Processor Type	Xeon
Socket	LGA 771
Lithography	65 nm
Chipset Category	Server
Memory Channels	4
ECC Support	Yes
Integrated Graphics	No
Process Technology	65 nm
Virtualization Technology	Yes
Release Date	2007
Architecture	Core
Supported CPU	Dual-Core and Quad-Core Xeon
FSB	1333 MHz/1600 MHz
Memory Type	FB-DIMM
Model	5400 Series
Number of Threads	4
L2 Cache	2 x 6 MB
Memory Support	DDR2 FB-DIMM
Instruction Set	64-bit
Number of Cores	Quad-Core