Intel 5400 Series User Manual

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 3
Contents
1Introduction..............................................................................................................9
1.1 Objective ...........................................................................................................9
1.2 Scope ................................................................................................................9
1.3 References .........................................................................................................9
1.4 Definition of Terms ............................................................................................ 10
2 Thermal/Mechanical Reference Design.................................................................... 13
2.1 Mechanical Requirements ................................................................................... 13
2.1.1 Processor Mechanical Parameters ............................................................. 13
2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package............................ 14
2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations................... 18
2.2 Processor Thermal Parameters and Features ......................................................... 19
2.2.1 Thermal Control Circuit and TDP............................................................... 19
2.2.2 Digital Thermal Sensor............................................................................ 20
2.2.3 Platform Environmental Control Interface (PECI) ........................................ 21
2.2.4 Multiple Core Special Considerations ......................................................... 21
2.2.5 Thermal Profile ...................................................................................... 24
2.2.6 TCONTROL Definition .............................................................................. 25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon®
Processor 5400 Series............................................................................. 26
2.2.8 Performance Targets............................................................................... 28
2.3 Fan Fail Guidelines ............................................................................................ 32
2.4 Characterizing Cooling Solution Performance Requirements..................................... 33
2.4.1 Fan Speed Control.................................................................................. 33
2.4.2 Processor Thermal Characterization Parameter Relationships........................ 34
2.4.3 Chassis Thermal Design Considerations ..................................................... 36
2.5 Thermal/Mechanical Reference Design Considerations ............................................ 37
2.5.1 Heatsink Solutions.................................................................................. 37
2.5.2 Thermal Interface Material....................................................................... 38
2.5.3 Summary .............................................................................................. 38
2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design........... 39
2.5.5 Thermal Solution Performance Characteristics ............................................ 41
2.5.6 Thermal Profile Adherence....................................................................... 42
2.5.7 Components Overview ............................................................................ 45
2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel®
Xeon® Processor 5400 Series Thermal Profile ............................................ 49
A 1U Alternative Heatsink Thermal/Mechanical Design............................................... 53
A.1 Component Overview......................................................................................... 53
A.2 Thermal Solution Performance Characterics .......................................................... 54
A.3 Thermal Profile Adherence.................................................................................. 54
B Mechanical Drawings ............................................................................................... 57
C Heatsink Clip Load Methodology .............................................................................. 83
C.1 Overview ......................................................................................................... 83
C.2 Test Preparation................................................................................................ 83
C.2.1 Heatsink Preparation .............................................................................. 83
C.2.2 Typical Test Equipment ........................................................................... 86
C.2.3 Test Procedure Examples ........................................................................ 86
C.2.4 Time-Zero, Room Temperature Preload Measurement ................................. 86
C.2.5 Preload Degradation under Bake Conditions ............................................... 87

Intel 5400 Series Specifications

General

Processor Type	Xeon
Socket	LGA 771
Lithography	65 nm
Chipset Category	Server
Memory Channels	4
ECC Support	Yes
Integrated Graphics	No
Process Technology	65 nm
Virtualization Technology	Yes
Release Date	2007
Architecture	Core
Supported CPU	Dual-Core and Quad-Core Xeon
FSB	1333 MHz/1600 MHz
Memory Type	FB-DIMM
Model	5400 Series
Number of Threads	4
L2 Cache	2 x 6 MB
Memory Support	DDR2 FB-DIMM
Instruction Set	64-bit
Number of Cores	Quad-Core