Intel 5400 Series User Manual

4 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
D Safety Requirements................................................................................................89
E Quality and Reliability Requirements .......................................................................91
E.1 Intel Verification Criteria for the Reference Designs ................................................91
E.1.1 Reference Heatsink Thermal Verification ....................................................91
E.1.2 Environmental Reliability Testing ..............................................................91
E.1.3 Material and Recycling Requirements.........................................................93
F Enabled Suppliers Information.................................................................................95
F.1 Supplier Information ..........................................................................................95
F.1.1 Intel Enabled Suppliers............................................................................95
F.1.2 Additional Suppliers ................................................................................96
Figures
2-1 Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 of 3)............15
2-2 Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3)............16
2-3 Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 of 3)............17
2-4 Processor Case Temperature Measurement Location ...............................................19
2-5 DTS Domain for Quad-Core Intel® Xeon® Processor 5400 Series ............................21
2-6 Processor Core Geometric Center Locations ...........................................................23
2-7 Thermal Profile Diagram .....................................................................................24
2-8 TCONTROL Value and Digital Thermal Sensor Value Interaction................................25
2-9 TCONTROL and Thermal Profile Interaction............................................................26
2-10 Dual Thermal Profile Diagram ..............................................................................27
2-11 Thermal Profile for the Quad-Core Intel® Xeon® Processor X5400 Series..................29
2-12 Thermal Profile for Quad-Core Intel® Xeon® Processor E5400 Series .......................30
2-13 Thermal Profile for Quad-Core Intel® Xeon® Processor X5482 Series .......................31
2-14 TCONTROL and Fan Speed Control .......................................................................33
2-15 Processor Thermal Characterization Parameter Relationships ...................................35
2-16 Exploded View of CEK Thermal Solution Components..............................................39
2-17 2U+ CEK Heatsink Thermal Performance...............................................................41
2-18 1U CEK Heatsink Thermal Performance.................................................................42
2-19 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400
Series Thermal Profile A......................................................................................43
2-20 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400
Series Thermal Profile B......................................................................................44
2-21 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400
Series Thermal Profile ........................................................................................45
2-22 Isometric View of the 2U+ CEK Heatsink...............................................................46
2-23 Isometric View of the 1U CEK Heatsink .................................................................46
2-24 CEK Spring Isometric View..................................................................................48
2-25 Isometric View of CEK Spring Attachment to the Base Board ...................................48
2-26 Boxed Active CEK Heatsink Solutions with PWM/DTS Control
(Representation Only) ........................................................................................49
2-27 Fan Cable Connection (Active CEK) ......................................................................50
A-1 Isometric View of the 1U Alternative Heatsink........................................................53
A-2 1U Alternative Heatsink Thermal Performance .......................................................54
A-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®
Processor L5400 Series Thermal Profile.................................................................55
B-1 2U CEK Heatsink (Sheet 1 of 4) ...........................................................................58
B-2 2U CEK Heatsink (Sheet 2 of 4) ...........................................................................59
B-3 2U CEK Heatsink (Sheet 3 of 4) ...........................................................................60
B-4 2U CEK Heatsink (Sheet 4 of 4) ...........................................................................61

Intel 5400 Series Specifications

General

Processor Type	Xeon
Socket	LGA 771
Lithography	65 nm
Chipset Category	Server
Memory Channels	4
ECC Support	Yes
Integrated Graphics	No
Process Technology	65 nm
Virtualization Technology	Yes
Release Date	2007
Architecture	Core
Supported CPU	Dual-Core and Quad-Core Xeon
FSB	1333 MHz/1600 MHz
Memory Type	FB-DIMM
Model	5400 Series
Number of Threads	4
L2 Cache	2 x 6 MB
Memory Support	DDR2 FB-DIMM
Instruction Set	64-bit
Number of Cores	Quad-Core