Intel 5400 Series User Manual

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 39
Thermal/Mechanical Reference Design
2.5.4 Assembly Overview of the Intel Reference Thermal
Mechanical Design
The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5400
Series thermal performance targets are called the Common Enabling Kit (CEK)
heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the
following components:
• Heatsink (with captive standoff and screws)
• Thermal Interface Material (TIM)
•CEK Spring
2.5.4.1 Geometric Envelope
The baseboard keepout zones on the primary and secondary sides and height
restrictions under the enabling component region are shown in detail in Appendix B.
The overall volumetric keep in zone encapsulates the processor, socket, and the entire
thermal/mechanical enabling solution.
2.5.4.2 Assembly Drawing
Figure 2-16. Exploded View of CEK Thermal Solution Components

Intel 5400 Series Specifications

General

Processor Type	Xeon
Socket	LGA 771
Lithography	65 nm
Chipset Category	Server
Memory Channels	4
ECC Support	Yes
Integrated Graphics	No
Process Technology	65 nm
Virtualization Technology	Yes
Release Date	2007
Architecture	Core
Supported CPU	Dual-Core and Quad-Core Xeon
FSB	1333 MHz/1600 MHz
Memory Type	FB-DIMM
Model	5400 Series
Number of Threads	4
L2 Cache	2 x 6 MB
Memory Support	DDR2 FB-DIMM
Instruction Set	64-bit
Number of Cores	Quad-Core