1U Alternative Heatsink Thermal/Mechanical Design
54 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
A.2 Thermal Solution Performance Characterics
Figure A-2 shows the performance of the 1U alternative heatsink. This figure shows the
thermal performance and the pressure drop through fins of the heatsink versus the
airflow provided. The best-fit equations for these curves are also provided to make it
easier for users to determine the desired value without any error associated with
reading the graph.
A.3 Thermal Profile Adherence
The 1U alternative thermal solution is designed to meet the Thermal Profile for the
Quad-Core Intel® Xeon® Processor E5400 Series in volumetrically constrained form
factors. From Tabl e A- 1 the three-sigma (mean+3sigma) performance of the thermal
solution is computed to be 0.331 °C/W and the processor local ambient temperature
(T
LA
) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this
thermal solution is calculated as:
Equation A-1. y = 0.331*x + 40
where,
y = Processor T
CASE
value (°C)
Figure A-2. 1U Alternative Heatsink Thermal Performance
Table A-1. 1U Alternative Heatsink Thermal Mechanical Characteristics
Size
Height Weight Target Airflow
Through Fins
Mean Ψ
ca
Standard
Deviation Ψ
ca
Pressure
Drop
(mm) [in.] (kg) [lbs] (m
3
/hr) [CFM] (°C/W) (°C/W)
(Pa) [in
H
2
O]
1U 27.00
[1.06]
0.24 [0.53] 25.5 [15] 0.305 0.0087 85 [0.34]
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