Thermal/Mechanical Reference Design
48 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
2.5.7.3 CEK Spring
The CEK spring, which is attached on the secondary side of the baseboard, is made
from 0.80 mm [0.0315 in.] thick 301 stainless steel half hard. Any future versions of
the spring will be made from a similar material. The CEK spring has four embosses
which, when assembled, rest on the top of the chassis standoffs. The CEK spring is
located between the chassis standoffs and the heatsink standoffs. The purpose of the
CEK spring is to provide compressive preload at the TIM interface when the baseboard
is pushed down upon it. This spring does not function as a clip of any kind. The two
tabs on the spring are used to provide the necessary compressive preload for the TIM
when the whole solution is assembled. The tabs make contact on the secondary side of
the baseboard. In order to avoid damage to the contact locations on the baseboard, the
tabs are insulated with a 0.127 mm [0.005 in.] thick Kapton* tape (or equivalent).
Figure 2-24 shows an isometric view of the CEK spring design.
Please refer to Appendix B for more detailed mechanical drawings of the CEK spring.
Also, the baseboard keepout requirements shown in Appendix B must be met to use
this CEK spring design.
Figure 2-24. CEK Spring Isometric View
Figure 2-25. Isometric View of CEK Spring Attachment to the Base Board
Secondary
Primary
Secondary
Primary
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