Intel 5400 Series

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 57
Mechanical Drawings
B Mechanical Drawings
The mechanical drawings included in this appendix refer to the thermal mechanical
enabling components for the Quad-Core Intel® Xeon® Processor 5400 Series.
Note: Intel reserves the right to make changes and modifications to the design as necessary.
Table B-1. Mechanical Drawing List
Drawing Description Figure Number
“2U CEK Heatsink (Sheet 1 of 4)” Figure B-1
“2U CEK Heatsink (Sheet 2 of 4)” Figure B-2
“2U CEK Heatsink (Sheet 3 of 4)” Figure B-3
“2U CEK Heatsink (Sheet 4 of 4)” Figure B-4
“CEK Spring (Sheet 1 of 3)” Figure B-5
“CEK Spring (Sheet 2 of 3)” Figure B-6
“CEK Spring (Sheet 3 of 3)” Figure B-7
“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 1 of 6)”
Figure B-8
“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 2 of 6)”
Figure B-9
“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 3 of 6)”
Figure B-10
“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 4 of 6)”
Figure B-11
“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 5 of 6)”
Figure B-12
“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components
(Sheet 6 of 6)”
Figure B-13
“1U CEK Heatsink (Sheet 1 of 4)” Figure B-14
“1U CEK Heatsink (Sheet 2 of 4)” Figure B-15
“1U CEK Heatsink (Sheet 3 of 4)” Figure B-16
“1U CEK Heatsink (Sheet 4 of 4)” Figure B-17
“Active CEK Thermal Solution Volumetric (Sheet 1 of 3)” Figure B-18
“Active CEK Thermal Solution Volumetric (Sheet 2 of 3)” Figure B-19
“Active CEK Thermal Solution Volumetric (Sheet 3 of 3)” Figure B-20
“1U Alternative Heatsink (1 of 4)” Figure B-21
“1U Alternative Heatsink (2 of 4)” Figure B-22
“1U Alternative Heatsink (3 of 4)” Figure B-23
“1U Alternative Heatsink (4 of 4)” Figure B-24