Intel 5400 Series User Manual

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 87
Heatsink Clip Load Methodology
(often on the order of 3 minutes). The time zero reading should be taken at the end
of this settling time.
5. Record the preload measurement (total from all three load cells) at the target time
and average the values over 10 seconds around this target time as well, i.e. in the
interval for example over [target time – 5 seconds; target time + 5 seconds].
C.2.5 Preload Degradation under Bake Conditions
This section describes an example of testing for potential clip load degradation under
bake conditions.
1. Preheat thermal chamber to target temperature (45 ºC or 85 ºC for example).
2. Repeat time-zero, room temperature preload measurement.
3. Place unit into preheated thermal chamber for specified time.
4. Record continuous load cell data as follows:
Sample rate = 0.1 Hz for first 3 hrs
Sample rate = 0.01 Hz for the remainder of the bake test
5. Remove assembly from thermal chamber and set into room temperature conditions
6. Record continuous load cell data for next 30 minutes at sample rate of 1 Hz.
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Intel 5400 Series Specifications

General

Processor Type	Xeon
Socket	LGA 771
Lithography	65 nm
Chipset Category	Server
Memory Channels	4
ECC Support	Yes
Integrated Graphics	No
Process Technology	65 nm
Virtualization Technology	Yes
Release Date	2007
Architecture	Core
Supported CPU	Dual-Core and Quad-Core Xeon
FSB	1333 MHz/1600 MHz
Memory Type	FB-DIMM
Model	5400 Series
Number of Threads	4
L2 Cache	2 x 6 MB
Memory Support	DDR2 FB-DIMM
Instruction Set	64-bit
Number of Cores	Quad-Core