Quality and Reliability Requirements
92 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Note: In the case of a discrepancy, information in the most recent LGA771 Socket Mechanical Design
Guidelines supersedes that in the Table E-1 above.
E.1.2.2 Recommended Test Sequence
Each test sequence should start with components (i.e. baseboard, heatsink assembly,
etc.) that have not been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly, and
BIOS/Processor/memory test. The stress test should be then followed by a visual
inspection and then BIOS/Processor/memory test.
E.1.2.3 Post-Test Pass Criteria
The post-test pass criteria are:
1. No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flatly against the IHS
surface. No visible gap between the heatsink base and processor IHS. No visible tilt
of the heatsink with respect to the retention hardware.
Table E-1. Use Conditions Environment
Use Environment
Speculative Stress
Condition
Example Use
Condition
Example 7-Yr
Stress Equiv.
Example 10-
Yr Stress
Equiv.
Shipping and
Handling
Mechanical Shock
• System-level
•Unpackaged
•Trapezoidal
• 25 g
• velocity change is based
on packaged weight
Total of 12
drops per
system:
•2 drops per
axis
•± direction
n/a n/a
Product
Weight (lbs)
Non-
palletized
Product
Velocity
Change
†
(in/
sec)
< 20 lbs
20 to > 40
40 to > 80
80 to < 100
100 to <
120
≥120
250
225
205
175
145
125
†
Change in velocity is based
upon a 0.5 coefficient of
restitution.
Shipping and
Handling
Random Vibration
• System Level
•Unpackaged
• 5 Hz to 500 Hz
• 2.20 g RMS random
• 5 Hz @ .001 g
2
/Hz to
20 Hz @ 0.01 g
2
/Hz
(slope up)
• 20 Hz to 500 Hz @ 0.01
g
2
/Hz (flat)
• Random control limit
tolerance is ± 3 dB
Tot a l p er
system:
• 10 minutes
per axis
•3 axes
n/a n/a
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