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Intel 5400 Series User Manual

Intel 5400 Series
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Thermal/Mechanical Reference Design
32 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Note: Intel does not enable reference heatsink for the Quad-Core Intel® Xeon®
Processor X5482 with 150W TDP. The Intel 2U CEK is capable of meeting the
thermal specification when local ambient temperature (T
LA
) is maintained at
or below 35°C.
2.3 Fan Fail Guidelines
Under fan failure or other anomalous thermal excursions, Tcase may exceed Thermal
Profile [Thermal Profile B for Quad-Core Intel® Xeon® Processor X5400 Series] for a
duration totaling less than 360 hours per year without affecting long term reliability
(life) of the processor. For more typical thermal excursions, Thermal Monitor is
expected to control the processor power level as long as conditions do not allow the
Tcase to exceed the temperature at which Thermal Control Circuit (TCC) activation
initially occurred. Under more severe anomalous thermal excursions when the
processor temperature cannot be controlled at or below this Tcase level by TCC
activation, then data integrity is not assured. At some higher threshold THERMTRIP#
will enable a shut down in an attempt to prevent permanent damage to the processor.
Thermal Test Vehicles (TTVs) may be used to check anomalous thermal excursion
compliance by ensuring that the processor Tcase value, as measured on the TTV, does
not exceed Tcase_max [Tcase_max_B for Quad-Core Intel® Xeon® Processor X5400
Series] at the anomalous power level for the environmental condition of interest. This
anomalous power level is equal to 80% of the TDP limit for Quad-Core Intel® Xeon®
Processor X5400 Series with 120W TDP and 90% of the TDP limit for Quad-Core Intel®
Xeon® Processor E5400 Series with 80W TDP.
Note: Fan Failure Guidelines apply only to SKUs which have Thermal Monitor2 enabled.
Table 2-5. Intel Reference Heatsink Performance Targets for the Quad-Core Intel®
Xeon® Processor E5400 Series
Parameter Maximum Unit Notes
Altitude Sea-Level m Heatsink designed at 0 meters
T
LA
40 °C
TDP
80 W
1U CEK
T
CASE_MAX
67 °C
Airflow
15
25.5
CFM
m
3
/ hr
Airflow through the heatsink fins
Pressure Drop
0.331
82.4
Inches of H
2
O
Pa
ψ
CA
0.246 °C/W Mean + 3σ
1U Alternative Heatsink
T
CASE_MAX
67 °C
Airflow
15
25.5
CFM
m
3
/ hr
Airflow through the heatsink fins
Pressure Drop
0.331
82.4
Inches of H
2
O
Pa
ψ
CA
0.331 °C/W Mean + 3σ

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Intel 5400 Series Specifications

General IconGeneral
Processor TypeXeon
SocketLGA 771
Lithography65 nm
Chipset CategoryServer
Memory Channels4
ECC SupportYes
Integrated GraphicsNo
Process Technology65 nm
Virtualization TechnologyYes
Release Date2007
ArchitectureCore
Supported CPUDual-Core and Quad-Core Xeon
FSB1333 MHz/1600 MHz
Memory TypeFB-DIMM
Model5400 Series
Number of Threads4
L2 Cache2 x 6 MB
Memory SupportDDR2 FB-DIMM
Instruction Set64-bit
Number of CoresQuad-Core

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