Intel 5400 Series User Manual

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 5
B-5 CEK Spring (Sheet 1 of 3) .................................................................................. 62
B-6 CEK Spring (Sheet 2 of 3) .................................................................................. 63
B-7 CEK Spring (Sheet 3 of 3) .................................................................................. 64
B-8 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (Sheet 1 of 6).................................................................... 65
B-9 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (Sheet 2 of 6).................................................................... 66
B-10 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (Sheet 3 of 6).................................................................... 67
B-11 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (Sheet 4 of 6).................................................................... 68
B-12 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (Sheet 5 of 6).................................................................... 69
B-13 Baseboard Keepout Footprint Definition and Height Restrictions for
Enabling Components (Sheet 6 of 6).................................................................... 70
B-14 1U CEK Heatsink (Sheet 1 of 4)........................................................................... 71
B-15 1U CEK Heatsink (Sheet 2 of 4)........................................................................... 72
B-16 1U CEK Heatsink (Sheet 3 of 4)........................................................................... 73
B-17 1U CEK Heatsink (Sheet 4 of 4)........................................................................... 74
B-18 Active CEK Thermal Solution Volumetric (Sheet 1 of 3)........................................... 75
B-19 Active CEK Thermal Solution Volumetric (Sheet 2 of 3)........................................... 76
B-20 Active CEK Thermal Solution Volumetric (Sheet 3 of 3)........................................... 77
B-21 1U Alternative Heatsink (1 of 4) .......................................................................... 78
B-22 1U Alternative Heatsink (2 of 4) .......................................................................... 79
B-23 1U Alternative Heatsink (3 of 4) .......................................................................... 80
B-24 1U Alternative Heatsink (4 of 4) .......................................................................... 81
C-1 Load Cell Installation in Machined Heatsink Base Pocket - Bottom View..................... 84
C-2 Load Cell Installation in Machined Heatsink Base Pocket - Side View......................... 85
C-3 Preload Test Configuration.................................................................................. 85

Intel 5400 Series Specifications

General

Processor Type	Xeon
Socket	LGA 771
Lithography	65 nm
Chipset Category	Server
Memory Channels	4
ECC Support	Yes
Integrated Graphics	No
Process Technology	65 nm
Virtualization Technology	Yes
Release Date	2007
Architecture	Core
Supported CPU	Dual-Core and Quad-Core Xeon
FSB	1333 MHz/1600 MHz
Memory Type	FB-DIMM
Model	5400 Series
Number of Threads	4
L2 Cache	2 x 6 MB
Memory Support	DDR2 FB-DIMM
Instruction Set	64-bit
Number of Cores	Quad-Core