Figure 3-1. LGA3647-1 Socket Assembly with PnP Covers
Socket Mechanical Design
Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG Order Number: 334785-002
20
3.1.1 Socket Features
LGA3647-1 socket attributes are listed in Tab le 3-1. The socket incorporates a roughly
rectangular pin grid with a hexagonal depopulation region in the center of the array and
selective depopulation elsewhere; see Appendix D. The pin field geometry is a
hexagonal array as shown in Figure 3-2 below. The tips of the socket pin contacts
extend above the surface of the socket to mak
e contact with the pads located at the
bottom of the processor package.
Solder balls enable the socket to be surface-mounted to the main board. Each contact
has
a corresponding solder ball. Solder ball position may be at an offset with respect to
the contact tip and base. Socket BGA ball hexagonal array ball-out pattern shown in
Figure 3-2 increases contact density by 12% while maintaining 39 mil minimum via
pitch requirements.
Table 3-1. LGA3647-1 Socket Attributes
LGA3647-1 Socket Attributes
Socket Wall Exterior Dimension 82 mm (L) x 62 mm (W)
Socket Wall Interior Dimension (Package Size) 76.16 mm (L) x 56.6 mm (W)
Pitch (hexagonal pattern) 0.8585 mm (X) x 0.9906 mm (Y)
Ball Count 3647
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