Intel Xeon Phi Processor x200 User Manual

Order Number: 334785-002 Intel
®
Xeon
®
Phi™ Processor x200 Product Family TMSDG
45

Thermal Specifications and Design Guidelines
.
Figure 6-1. Processor Package Thermocouple Locations, Top view
The processor and MCDRAM T
CASE
value will be influenced by the other powered
devices integrated on the MCP. This relationship is described in the following equations:
T
CASE_CPU
= T
LA
+ 
CC
* P
CPU
+ 
CM
* P
MCDRAM
+ 
CF
* P
Fabric
T
CASE_MCDRAM
= T
LA
+ 
MC
* P
CPU
+ 
MM
* P
MCDRAM
+ 
MF
* P
Fabric
Table 6-3. Processor T
CASE
Influence Parameters
Parameter Description
Reference Solution
Expected Value
T
case_CPU
Temperature on the IHS surface above the processor hot spot Calculated
T
case_MCDRAM
Temperature on the IHS surface above the MCDRAM hot spot Calculated
T
LA
Temperature of the local ambient air at the heatsink inlet < 40 °C
P
CPU
Power dissipated by the processor Workload Dependent
1
P
MCDRAM
Power dissipated by MCDRAMs Workload Dependent
1
P
FABRIC
Power dissipated by the fabric controller (processor with fabric only) Workload Dependent
1

CC
Thermal resistance: IHS processor hot spot due to its own power 0.212 °C/W

CM
Thermal resistance: IHS processor hot spot due to MCDRAM power 0.134 °C/W

CF
Thermal resistance: IHS processor hot spot due to fabric power 0.140 °C/W

MC
Thermal resistance: IHS MCDRAM hot spot due to processor power 0.147 °C/W

MM
Thermal resistance: IHS MCDRAM hot spot due to its own power 0.177 °C/W

MF
Thermal resistance: IHS MCDRAM hot spot due to fabric power 0.196 °C/W
Note: 1. Tho
ugh the constituent device powers may vary with workload, the combined powers must add up to
be less than or equal to the Thermal Design Power (TDP).

Intel Xeon Phi Processor x200 Specifications

General

Brand	Intel
Model	Xeon Phi Processor x200
Category	Computer Hardware
Language	English